DMN2005UFGQ-7中文资料美台半导体数据手册PDF规格书

特性 Features

 Low RDS(ON)—Ensures On-State Losses are Minimized

 Small-Form Factor Thermally Efficient Package Enables Higher

Density End Products

 Occupies 33 of the Board Area Occupied by SO-8 Enabling

Smaller End Product

 100 Unclamped Inductive Switching, Test in Production—

Ensures More Reliable And Robust End Application

 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)

 Halogen and Antimony Free. “Green” Device (Note 3)

 Qualified to AEC-Q101 Standards for High Reliability

 PPAP Capable (Note 4)