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CMR1-04M

SURFACEMOUNTSILICONGENERALPURPOSERECTIFIERS

CentralCentral Semiconductor Corp

美国中央半导体

CMR1-04M

SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1AMP

CentralCentral Semiconductor Corp

美国中央半导体

CXR1-04

SURFACEMOUNTGENERALPURPOSERECTIFIER

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CXR1-04

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CXR1-04C

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CZR1-04

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CZR1-04

SURFACEMOUNTHIGHVOLTAGERECTIFIER

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CZR1-04C

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CZR1-04C

SURFACEMOUNTHIGHVOLTAGERECTIFIER

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

HS-QSFP-P1-04

FLYOVER®QSFPCABLEASSEMBLIES

SamtecSamtec, Inc

美国申泰

供应商型号品牌批号封装库存备注价格
24+
N/A
57000
一级代理-主营优势-实惠价格-不悔选择
询价
ADAMTECH
2447
SMD
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
询价
Diodes
22+
9000
原厂渠道,现货配单
询价
Diodes Incorporated
24+
V-DFN3030-8
36500
一级代理/放心采购
询价
DIODES
20+
IC
3000
就找我吧!--邀您体验愉快问购元件!
询价
DIODES
22+
NA
12080
加我QQ或微信咨询更多详细信息,
询价
DIODES(美台)
24+
DFN30308
7350
现货供应,当天可交货!免费送样,原厂技术支持!!!
询价
Diodes Incorporated
23+
V-DFN3030-8
7300
专注配单,只做原装进口现货
询价
Diodes Incorporated
23+
V-DFN3030-8
7300
专注配单,只做原装进口现货
询价
Diodes Incorporated
23+/24+
8-VDFN
8600
只供原装进口公司现货+可订货
询价
更多DML-1-04-A-V-T-A供应商 更新时间2025-5-23 11:06:00