首页 >CXR1-04>规格书列表

零件编号下载 订购功能描述/丝印制造商 上传企业LOGO

CXR1-04

SURFACE MOUNT GENERAL PURPOSE RECTIFIER

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CXR1-04

1 Amp Glass Passivated Rectifier Chip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CXR1-04_10

SURFACE MOUNT GENERAL PURPOSE SILICON RECTIFIER

DESCRIPTION: TheCENTRALSEMICONDUCTORCXR1-04typeisaSiliconGeneralPurposeRectifierdesignedforapplicationsrequiringhighvoltagecapability. MARKING:FULLPARTNUMBER

CentralCentral Semiconductor Corp

美国中央半导体

CXR1-04C

1 Amp Glass Passivated Rectifier Chip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CXR1-04_15

SURFACE MOUNT GENERAL PURPOSE SILICON RECTIFIER

CentralCentral Semiconductor Corp

美国中央半导体

CZR1-04

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CZR1-04

SURFACEMOUNTHIGHVOLTAGERECTIFIER

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CZR1-04C

SURFACEMOUNTHIGHVOLTAGERECTIFIER

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CZR1-04C

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

HS-QSFP-P1-04

FLYOVER®QSFPCABLEASSEMBLIES

SamtecSamtec, Inc

美国申泰

详细参数

  • 型号:

    CXR1-04

  • 制造商:

    CENTRAL

  • 制造商全称:

    Central Semiconductor Corp

  • 功能描述:

    SURFACE MOUNT GENERAL PURPOSE RECTIFIER

供应商型号品牌批号封装库存备注价格
CENTRAL
23+
原厂原包
19960
只做进口原装 终端工厂免费送样
询价
SONY
23+
DIP-8
5000
原装正品,假一罚十
询价
2023+
QFP
3000
进口原装现货
询价
XILINX/赛灵思
20+
QFP44
2300
全新原装,价格超越代理。
询价
XILINX/赛灵思
22+
QFP44
20000
保证原装正品,假一陪十
询价
XILINX
2021
BGA
1000
全新、原装
询价
XILINX/赛灵思
23+
QFP44
10000
原厂授权一级代理,专业海外优势订货,价格优势、品种
询价
XILINX/赛灵思
23+
QFP44
9920
原装正品,支持实单
询价
XILINX/赛灵思
23+
QFP
3127
现货
询价
XILINX/赛灵思
21+
QFP44
2315
附带出货证明-价格低于市场百分之五十
询价
更多CXR1-04供应商 更新时间2025-5-9 17:55:00