Diode Module with Chopper-IGBT

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文件：163.33 Kbytes 页数：13 Pages

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EconoPACK™2 module with Low Loss IGBT2 and Emitter Controlled diode and PressFIT / NTC

Mechanical Features •Al2O3 Substrate with Low Thermal Resistance • High Power Density • Isolated Base Plate • Compact design • PressFIT Contact Technology • RoHS compliant • Standard Housing

文件：625.97 Kbytes 页数：10 Pages

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EconoPACK™2 module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT

Mechanical Features •Al2O3 Substrate with Low Thermal Resistance • High Power Density • Isolated Base Plate • Compact design • PressFIT Contact Technology • RoHS compliant • Standard Housing

文件：629.59 Kbytes 页数：10 Pages

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EconoPACK™2 module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC

Mechanical Features •Al2O3 substrate with low thermal resistance • High power density • Isolated base plate • Compact design • PressFIT contact technology • RoHS compliant • Standard housing

文件：627.58 Kbytes 页数：11 Pages

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EconoPACK?? Modul mit Trench/Feldstopp IGBT4 und Emitter Controlled 4 Diode und PressFIT

Electrical Features • Tvj op = 150°C Mechanical Features • Al₂O3 substrate with low thermal resistance • High power density • Isolated base plate • Compact design • PressFIT contact technology • RoHS compliant • Standard housing • Pre-applied Thermal Interface Material

文件：656.97 Kbytes 页数：11 Pages

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EconoPACK?? Modul mit Trench/Feldstopp IGBT4 und Emitter Controlled 4 Diode und PressFIT

Electrical Features • Tvj op = 150°C Mechanical Features • Al₂O3 substrate with low thermal resistance • High power density • Isolated base plate • Compact design • PressFIT contact technology • RoHS compliant • Standard housing • Pre-applied Thermal Interface Material

文件：656.97 Kbytes 页数：11 Pages

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Preliminary datasheet EasyBRIDGE module with chopper configuration

Features • Electrical features - VCES = 1200 V - IC nom = 50 A / ICRM = 100 A - TRENCHSTOPTM IGBT7 • Mechanical features - Al2O3 substrate with low thermal resistance - Compact design - Solder contact technology - Rugged mounting due to integrated mounting clamps Potential applications

文件：420.23 Kbytes 页数：13 Pages

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Preliminary datasheet EasyBRIDGE module with chopper configuration and pre-applied Thermal Interface Material

Features • Electrical features - VCES = 1200 V - IC nom = 50 A / ICRM = 100 A - TRENCHSTOPTM IGBT7 • Mechanical features - Al2O3 substrate with low thermal resistance - Compact design - Solder contact technology - Pre-applied Thermal Interface Material - Rugged mounting due to integrated

文件：477.22 Kbytes 页数：15 Pages

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英飞凌

Preliminary datasheet EasyBRIDGE module with chopper configuration and PressFIT / pre-applied Thermal Interface Material

Features Electrical features - VCES = 1200 V - IC nom = 50 A / ICRM = 100 A - TRENCHSTOPTM IGBT7 Mechanical features - Al2O3 substrate with low thermal resistance - Compact design - PressFIT contact technology - Pre-applied Thermal Interface Material - Rugged mounting due to integrated m

文件：500.48 Kbytes 页数：14 Pages

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EasyBRIDGE module with chopper configuration and PressFIT / pre-applied thermal interface material

Features • Electrical features - VCES = 1700 V - IC nom = 50 A / ICRM = 100 A - Tvj,op = 150°C - Trench IGBT 4 - 2.2 kV rectifier diodes • Mechanical features - Al2O3 substrate with low thermal resistance - 4 kV AC 1 min insulation - PressFIT contact technology - Compact design - Rugge

文件：460.77 Kbytes 页数：15 Pages

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