50A 8.4mm/9.5mm DISH DIODE

Features Glass Passivated Die Construction Low Leakage Low Cost High Surge Current Capability Low Forward C-Band Terminal Construction

文件：23.63 Kbytes 页数：2 Pages

WTE

Won-Top Electronics

50A 8.4mm/9.5mm DISH DIODE

Won-top

毅星

50A 8.4mm/9.5mm DISH DIODE

Features Glass Passivated Die Construction Low Leakage Low Cost High Surge Current Capability Low Forward C-Band Terminal Construction

文件：23.63 Kbytes 页数：2 Pages

WTE

Won-Top Electronics

IHM-B Modul

TypicalApplications • Mediumvoltageconverters • Motordrives • Tractiondrives • UPSsystems • Windturbines ElectricalFeatures • HighDCstability • Lowswitchinglosses

文件：591.51 Kbytes 页数：7 Pages

Infineon

英飞凌

hochisolierendes Modul

high insulated module Potential Applications • Medium voltage converters • Traction drives

文件：414.22 Kbytes 页数：7 Pages

Infineon

英飞凌

IGBT-Module

IGBT-Module high insulated module Typical Applications • Medium Voltage Converters • Traction Drivers

文件：404 Kbytes 页数：7 Pages

Infineon

英飞凌

IGBT模块

3300V IHV B 130mm Diode Module with EC3 - Diode - The best solution for your traction and industry applications. Predestined to be combined with IGBT3 products. • High DC Stability\n• Low switching Losses\n• AlSiC Base Plate for increased Thermal Cycling Capability\n• Package with CTI > 600\n• Isolated Base Plate\n\n优势:\n• Standardized housing;

Infineon

英飞凌

6500 V、500 A 二极管 IGBT 模块

6500 V IHV 130mm Diode Module with EC3 - Diode - The best solution for your traction and industry applications. Predestined to be combined with IGBT3 products. • AlSiC Base Plate for increased Thermal Cycling Capability\n• Extended Storage Temperature down to T(stg) = -55°C\n• Package with CTI > 600\n• Package with enhanced Insulation of 10.2 kV AC 1min\n• High Creepage and Clearance Distance\n\n优势:\n• Standardized housing;

Infineon

英飞凌

Package：模块；包装：卷带（TR） 类别：分立半导体产品 二极管 - 整流器 - 阵列 描述：MODULE DIODE IHVB130-3

Infineon

英飞凌

Package：模块；包装：散装 类别：分立半导体产品 二极管 - 整流器 - 阵列 描述：DIODE MODULE VCES 3300V 500A

Infineon

英飞凌