hochisolierendes Modul

MechanicalFeatures • AlSiC base plate for increased thermal cycling capability • Extended storage temperature down to Tstg = -55°C • Package with CTI>600 • Package with enhanced insulation of 10.4kV AC 10s • High creepage and clearance distances Potential Applications • Medium voltage conve

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Infineon

英飞凌

高绝缘等级模块

6500 V IHV 130 mm Diode Module with Emitter Controlled 3 - Diode - The best solution for your traction and industry applications. Predestined to be combined with IGBT3 products. • 10.2 kV isolation\n• High reliability and robust module construction\n\n优势:\n• High power density for compact inverter designs\n• Standardized housing;

Infineon

英飞凌

Package：模块；包装：散装 类别：分立半导体产品 二极管 - 整流器 - 阵列 描述：IHV IHM T XHP 3 3-6 5K

Infineon

英飞凌

Package：模块；包装：散装 类别：分立半导体产品 二极管 - 整流器 - 阵列 描述：DIODE MODULE GP 6500V AIHV130-6

Infineon

英飞凌