Three-Phase Si-Bridge-Rectifiers

文件：214.87 Kbytes 页数：2 Pages

Diotec

德欧泰克

丝印：DB151；Package：DB；Bridge Rectifiers

Features UL recognition, file #E313149 Glass passivated chip junction High surge current capability | Solder dip 275 °C max. 7 s, per JESD 22-B106 |

文件：913.85 Kbytes 页数：3 Pages

RFE

RFE international

丝印：DB152；Package：DB；Bridge Rectifiers

Features UL recognition, file #E313149 Glass passivated chip junction High surge current capability | Solder dip 275 °C max. 7 s, per JESD 22-B106 |

文件：913.85 Kbytes 页数：3 Pages

RFE

RFE international

丝印：DB153；Package：DB；Bridge Rectifiers

Features UL recognition, file #E313149 Glass passivated chip junction High surge current capability | Solder dip 275 °C max. 7 s, per JESD 22-B106 |

文件：913.85 Kbytes 页数：3 Pages

RFE

RFE international

丝印：DB154；Package：DB；Bridge Rectifiers

Features UL recognition, file #E313149 Glass passivated chip junction High surge current capability | Solder dip 275 °C max. 7 s, per JESD 22-B106 |

文件：913.85 Kbytes 页数：3 Pages

RFE

RFE international

丝印：DB154；Package：DFM；Silicon Bridge Rectifiers

FEATURES ● Rating to 1000V PRVP ● Surge overload rating to 40 Amperes peak ● Glass passivated chip junctions ● Reliable low cost construction utilizing molded plastic technique results in inexpensive product ● Lead solderable per MIL-STD-202 method 208 ● Lead: silver plated copper, solderde

文件：783.85 Kbytes 页数：4 Pages

BILIN

银河微电

丝印：DB154S；Package：DFS；Silicon Bridge Rectifiers

FEATURES ● Rating to 1000V PRVP ● Surge overload rating to 40 Amperes peak ● Glass passivated chip junctions ● Reliable low cost construction utilizing molded plastic technique results in inexpensive product ● Lead solderable per MIL-STD-202 method 208 ● Lead: silver plated copper, solderde

文件：818.71 Kbytes 页数：4 Pages

BILIN

银河微电

丝印：DB155；Package：DFM；Silicon Bridge Rectifiers

FEATURES ● Rating to 1000V PRVP ● Surge overload rating to 40 Amperes peak ● Glass passivated chip junctions ● Reliable low cost construction utilizing molded plastic technique results in inexpensive product ● Lead solderable per MIL-STD-202 method 208 ● Lead: silver plated copper, solderde

文件：783.85 Kbytes 页数：4 Pages

BILIN

银河微电

丝印：DB155；Package：DB；Bridge Rectifiers

Features UL recognition, file #E313149 Glass passivated chip junction High surge current capability | Solder dip 275 °C max. 7 s, per JESD 22-B106 |

文件：913.85 Kbytes 页数：3 Pages

RFE

RFE international

丝印：DB155S；Package：DFS；Silicon Bridge Rectifiers

FEATURES ● Rating to 1000V PRVP ● Surge overload rating to 40 Amperes peak ● Glass passivated chip junctions ● Reliable low cost construction utilizing molded plastic technique results in inexpensive product ● Lead solderable per MIL-STD-202 method 208 ● Lead: silver plated copper, solderde

文件：818.71 Kbytes 页数：4 Pages

BILIN

银河微电