DA14683数据手册RF/IF射频/中频RFID的射频收发器IC规格书PDF

厂商型号 |
DA14683 |
参数属性 | DA14683 封装/外壳为60-VQFN 双排裸露焊盘;包装为卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带;类别为RF/IF射频/中频RFID的射频收发器IC;产品描述:IC RF BLUETOOTH 5.0 SOC 60VQFN |
功能描述 | SmartBond™ Bluetooth® Low Energy 5.0 SoC with Enhanced Security |
封装外壳 | 60-VQFN 双排裸露焊盘 |
制造商 | Renesas Renesas Technology Corp |
中文名称 | 瑞萨 瑞萨科技有限公司 |
数据手册 | |
更新时间 | 2025-8-7 23:00:00 |
人工找货 | DA14683价格和库存,欢迎联系客服免费人工找货 |
DA14683规格书详情
描述 Description
The SmartBond™ DA14683 is one of the world's first single-chip solutions for smart home, industrial and wearable devices that meets the highest security standards. These highly integrated System-on-Chip (SoC) devices support Bluetooth® 5 as well as Bluetooth mesh, and include a range of dedicated features to ensure cutting-edge security for both consumers and developers.
The DA14683 comes with enhanced security features such as key manipulation, secure booting (i.e. starting the system only if the Flash image is authenticated), a complete public/private hardware acceleration engine and a hardware true random number generator (TRNG).
As part of our SmartBond range, the SoC offers industry-leading performance from the lowest power consumption and smallest footprint. Its flexible architecture ensures plenty of processing capacity when you need it while saving power when you don't. It also allows the device to manage multi-sensor arrays and enables always-on sensing.
The device offers extensive memory capacity. The DA14683 supports unlimited external Flash for maximum design flexibility . And, the device allows users to benefit from Over-the-Air (OTA) updates.
To further simplify development, our SmartSnippets™ software and versatile hardware development kits help users optimize their software for power consumption.
BenefitsHighest level of securityIPv6 connectivityLowest system powerLowest system BOMSmallest system sizePackagesAQFN-60 (6.0mm x 6.0mm x 0.9mm)WLCSP-53 (3.4mm x 3.0mm x 0.5mm)
应用 Application
• Wearables
• Smart home
• Cloud connected applications
• Industrial
• Human interface devices
• Virtual reality remotes
• Banking
技术参数
- 制造商编号
:DA14683
- 生产厂家
:Renesas
- Wireless Standard
:BLE 5.0 Core specification
- Proprietary 2G4 protocol
:No
- CPU
:M0
- Flash Memory (KB)
:0
- ROM (KB)
:128
- Memory Size (OTP) (KB)
:64
- RAM (KB)
:128
- GPIOs (#)
:37
- Supply Voltage Vcc Range
:1.7-4.75
- Integrated DCDC
:SIMO Buck DC-DC converter
- Integrated Battery Charger
:Yes
- External Rails and Load Capacity
:1.8V @ 75mA
- Tx Current (mA)
:5.2
- Rx current (mA)
:6
- Sensitivity (dBm) (dBm)
:-94
- Clock Rate (MHz)
:96
- Flexible System Clock
:是的
- Execute from FLASH
:是的
- Hardware Crypto Engine
:是的
- QSPI Interface (#)
:1
- SPI (#)
:2
- I2C (#)
:2
- UART (#)
:2
- ADC
:8ch 10b
- USB Ports (#)
:1
- LE Data Length Extensions
:Supported
- Bluetooth® Mesh
:On request
- Pkg. Type
:AQFN60
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
DIALOG |
24+ |
NA/ |
11250 |
原装现货,当天可交货,原型号开票 |
询价 | ||
RENESAS(瑞萨)/IDT |
24+ |
VFBGA86 |
7350 |
现货供应,当天可交货!免费送样,原厂技术支持!!! |
询价 | ||
23+ |
NA |
6800 |
原装正品,力挺实单 |
询价 | |||
Dialog |
25+ |
QFN |
394 |
原装正品,假一罚十! |
询价 | ||
Dialog Semiconductor |
20+ |
WLCSP-53 |
29860 |
RF片上系统SOC-可开原型号增税票 |
询价 | ||
IDT/RENESAS |
22+ |
BGA |
24500 |
瑞萨全系列在售 |
询价 | ||
DIALOG/RENESAS |
24+ |
QFN |
98671 |
专业代理蓝牙芯片原装现货 |
询价 | ||
DIALOG |
23+ |
QFN |
3000 |
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、 |
询价 | ||
DIALOGSEMICONDUCTOR |
2022+ |
1000 |
只做原装,价格优惠,长期供货。 |
询价 | |||
Dialog Semiconductor |
2447 |
UFBGA-53 |
315000 |
5000个/圆盘一级代理专营品牌!原装正品,优势现货, |
询价 |