DA14530中文资料SmartBond™ Low Power Bluetooth 5.1 System-on-Chip数据手册Renesas规格书

描述 Description

SmartBond TINY™, the world’s smallest and lowest power Bluetooth® 5.1 System-on-Chip (SoC), brings down the cost of adding Bluetooth Low Energy (LE) in any system and takes mobile connectivity to places previously out of reach, triggering a wave of a billion IoT devices, all with SmartBond TINY at the heart.

The low system cost is achieved through the high level of integration in SmartBond TINY: A complete Bluetooth Low Energy system can be achieved with the addition of six tiny external passives, a crystal and power source. And to lower the barrier of entry, SmartBond TINY is also available in an easy-to-use tiny module incorporating all the needed components, making the addition of Bluetooth Low Energy to any application a simple drop-in.

Record low hibernation and active power consumption ensure long operating and shelf life with even the tiniest, disposable batteries. Based on a powerful 32-bit Arm® Cortex®-M0+ with integrated memories and a complete set of analog and digital peripherals, SmartBond TINY is extremely power efficient, delivering a record score of 18300 on the latest EEMBC benchmark for IoT connectivity, IoTMark™. The DA14530 is pin-for-pin compatible with the DA14531 in a 2.2mm x 3.0mm FCGQFN24 package and provides cost savings by operating from an internal LDO, eliminating the cost of a DC/DC inductor. Available in a tiny 2.0mm x 1.7mm package, the DA14531 is half the size of its predecessor, or any offering from other leading manufacturers. And, it is complemented by a flexible SDK supporting major compilers such as Keil and GCC out of the box.

特性 Features

• Future proof, compliant with Bluetooth 5.1 (core)
• Optimized for disposable products in connected medical, connected consumer
• Designed to work with disposable, even printed batteries
• Works well with smallest capacity batteries, <30mAh
• Supports multiple years of shelf life
• Inrush current can be limited for disposable batteries with high internal resistance
• Package design allows for low cost manufacturing with smallest possible footprint

应用 Application

• 智能笔