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DA14531数据手册RF/IF射频/中频RFID的射频收发器IC规格书PDF

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厂商型号

DA14531

参数属性

DA14531 封装/外壳为17-XFBGA,WLCSP;包装为卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带;类别为RF/IF射频/中频RFID的射频收发器IC;产品描述:BLE 5.1 SOC WITH ARM CORTEX M0+

功能描述

SmartBond™ Ultra-Low Power Bluetooth® 5.1 System-on-Chip

封装外壳

17-XFBGA,WLCSP

制造商

Renesas Renesas Technology Corp

中文名称

瑞萨 瑞萨科技有限公司

数据手册

下载地址下载地址二

更新时间

2025-8-8 9:56:00

人工找货

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DA14531规格书详情

描述 Description

SmartBond TINY™, the world’s smallest and lowest power Bluetooth® 5.1 System-on-Chip (SoC), brings down the cost of adding Bluetooth Low Energy (LE) in any system and takes mobile connectivity to places previously out of reach, triggering a wave of a billion IoT devices, all with SmartBond TINY at the heart.

The low system cost is achieved through the high level of integration in SmartBond TINY: A complete Bluetooth Low Energy system can be achieved with the addition of six tiny external passives, a crystal and power source. And to lower the barrier of entry, SmartBond TINY is also available in an easy-to-use tiny module incorporating all the needed components, making the addition of Bluetooth Low Energy to any application a simple drop-in.

Record low hibernation and active power consumption ensure long operating and shelf life with even the tiniest, disposable batteries. Based on a powerful 32-bit Arm® Cortex®-M0+ with integrated memories and a complete set of analog and digital peripherals, SmartBond TINY is extremely power efficient, delivering a record score of 18300 on the latest EEMBC benchmark for IoT connectivity, IoTMark™. The DA14530 is pin-for-pin compatible with the DA14531 in a 2.2mm x 3.0mm FCGQFN24 package and provides cost savings by operating from an internal LDO, eliminating the cost of a DC/DC inductor. Available in a tiny 2.0mm x 1.7mm package, the DA14531 is half the size of its predecessor, or any offering from other leading manufacturers. And, it is complemented by a flexible SDK supporting major compilers such as Keil and GCC out of the box.

特性 Features

• Future proof, compliant with Bluetooth 5.1 (core)
• Optimized for disposable products in connected medical, connected consumer
• Designed to work with disposable, even printed batteries
• Works well with smallest capacity batteries, <30mAh
• Supports multiple years of shelf life
• Inrush current can be limited for disposable batteries with high internal resistance
• Package design allows for low cost manufacturing with smallest possible footprint

应用 Application

• 20-28 串电池组(高达 118V)
• 6 到 10 节电池驱动电机
• 具有 PFC 的大功率无刷直流吊扇
• 宠物追踪器
• 无线工业物联网网关
• 无线网络视频录像机
• 智能资产跟踪标签
• 条形码扫描仪系统
• 真无线立体声 (TWS) 耳塞充电底座
• 超低功耗 Wi-Fi 和蓝牙低能耗智能锁
• 远程控制的 PC 水冷却器

技术参数

  • 制造商编号

    :DA14531

  • 生产厂家

    :Renesas

  • Wireless Standard

    :BLE 5.1 Core specification

  • Proprietary 2G4 protocol

    :No

  • CPU

    :M0+

  • Flash Memory (KB)

    :0

  • ROM (KB)

    :144

  • Memory Size (OTP) (KB)

    :32

  • RAM (KB)

    :48

  • GPIOs (#)

    :12

  • Supply Voltage Vcc Range

    :1.1-3.6

  • Integrated DCDC

    :Integrated Buck/Boost DC-DC converter

  • Integrated Battery Charger

    :No

  • Tx Current (mA)

    :3.5

  • Rx current (mA)

    :2.2

  • Output Power Range (dBm)

    :2.5

  • Sensitivity (dBm) (dBm)

    :-94

  • Clock Rate (MHz)

    :16

  • Flexible System Clock

    :是的

  • Execute from FLASH

    :否

  • Hardware Crypto Engine

    :是的

  • SPI (#)

    :1

  • I2C (#)

    :1

  • UART (#)

    :2

  • ADC

    :4ch 10b

  • USB Ports (#)

    :0

  • LE Data Length Extensions

    :Supported

  • Pkg. Type

    :FCGQFN

供应商 型号 品牌 批号 封装 库存 备注 价格
DIALOG
22+
WFQFN24
6300
只做原装,假一罚百,长期供货。
询价
DIALOG
23+
QFN40
60000
代理原装现货,价格优势。
询价
Dialog Semiconductor
23+
TO-18
12800
原装正品代理商最优惠价格,现货或订货
询价
DIALOG
23+
FCGQFN-2
50000
全新原装正品现货,支持订货
询价
DIALOG
2023+
FCGQFN-2
8000
十五年行业诚信经营,专注全新正品
询价
DIALOG/戴乐格
22+
WFQFN24
60000
原装正品
询价
NA
23+
NA
26094
10年以上分销经验原装进口正品,做服务型企业
询价
DIALOG
2021+
QFN40
105000
原装现货,优势渠道订货假一赔十
询价
DIALOG
2042+
NA
7409
原装正品 价格极优
询价
DIALOG
23+
7300
专注配单,只做原装进口现货
询价