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DA14682中文资料SmartBond™ Bluetooth® Low Energy 5.0 SoC with Enhanced Security and Flash数据手册Renesas规格书

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厂商型号

DA14682

参数属性

DA14682 封装/外壳为60-VQFN 双排裸露焊盘;包装为卷带(TR);类别为RF/IF射频/中频RFID的射频收发器IC;产品描述:IC RF BLUETOOTH 5.0 SOC 60WFQFN

功能描述

SmartBond™ Bluetooth® Low Energy 5.0 SoC with Enhanced Security and Flash

封装外壳

60-VQFN 双排裸露焊盘

制造商

Renesas Renesas Technology Corp

中文名称

瑞萨 瑞萨科技有限公司

数据手册

下载地址下载地址二

更新时间

2025-9-23 14:04:00

人工找货

DA14682价格和库存,欢迎联系客服免费人工找货

DA14682规格书详情

描述 Description

The SmartBond™ DA14682 is one of the world's first single-chip solutions for smart home, industrial and wearable devices that meets the highest security standards. These highly integrated System-on-Chip (SoC) devices support Bluetooth® 5 as well as Bluetooth mesh, and include a range of dedicated features to ensure cutting-edge security for both consumers and developers.

As part of our SmartBond range, the SoC offers industry-leading performance from the lowest power consumption and smallest footprint. Its flexible architecture ensures plenty of processing capacity when you need it while saving power when you don't. It also allows the device to manage multi-sensor arrays and enables always-on sensing.

The device offers extensive memory capacity. The DA14682 includes 8Mbits of onboard Flash, making it ideal for applications with tight space constraints. And, the device allows users to benefit from Over-the-Air (OTA) updates.

To further simplify development, our SmartSnippets™ software and versatile hardware development kits help users optimize their software for power consumption.

BenefitsHighest level of securityIPv6 connectivityLowest system powerLowest system BOMSmallest system sizePackagesAQFN-60 (6.0mm x 6.0mm x 0.9mm)WLCSP-53 (3.4mm x 3.0mm x 0.5mm)

应用 Application

• Wearables
• Smart home
• Cloud connected applications
• Industrial
• Human interface devices
• Virtual reality remotes
• Banking

技术参数

  • 制造商编号

    :DA14682

  • 生产厂家

    :Renesas

  • Wireless Standard

    :BLE 5.0 Core specification

  • Proprietary 2G4 protocol

    :No

  • CPU

    :M0

  • Flash Memory (KB)

    :1024

  • ROM (KB)

    :128

  • Memory Size (OTP) (KB)

    :64

  • RAM (KB)

    :128

  • GPIOs (#)

    :31

  • Supply Voltage Vcc Range

    :1.7-4.75

  • Integrated DCDC

    :SIMO Buck DC-DC converter

  • Integrated Battery Charger

    :Yes

  • External Rails and Load Capacity

    :1.8V @ 75mA

  • Tx Current (mA)

    :5.2

  • Rx current (mA)

    :6

  • Sensitivity (dBm) (dBm)

    :-94

  • Clock Rate (MHz)

    :96

  • Flexible System Clock

    :是的

  • Execute from FLASH

    :是的

  • Hardware Crypto Engine

    :是的

  • SPI (#)

    :2

  • I2C (#)

    :2

  • UART (#)

    :2

  • ADC

    :8ch 10b

  • USB Ports (#)

    :1

  • LE Data Length Extensions

    :Supported

  • Bluetooth® Mesh

    :On request

  • Pkg. Type

    :AQFN60

供应商 型号 品牌 批号 封装 库存 备注 价格
IDT/RENESAS
22+
BGA
24500
瑞萨全系列在售
询价
DIALOGSEMICON
21+
NA
44000
只做原装,一定有货,不止网上数量,量多可订货!
询价
DIALOGSEMICONDUCTOR
23+
10000
原厂授权一级代理,专业海外优势订货,价格优势、品种
询价
RENESAS
24+
con
10000
查现货到京北通宇商城
询价
DIALOG
24+
NA
60000
全新原装现货
询价
Dialog Semiconductor
2021+
AQFN-60(6x6)
499
询价
Dialog
25+
QFN
394
原装正品,假一罚十!
询价
Dialog Semiconductor
2447
AQFN-60(6x6)
315000
4000个/圆盘一级代理专营品牌!原装正品,优势现货,
询价
DIALOG
23+
NA
50000
全新原装正品现货,支持订货
询价
RENESAS ELECTRONICS
24+
N/A
38300
原装原装原装
询价