CR0603/CR0805/CR1206 - Chip Resistors

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Bourns

伯恩斯

CR0603/CR0805/CR1206 - Chip Resistors

文件：180.75 Kbytes 页数：5 Pages

Bourns

伯恩斯

Tight tolerances of bottom electrode width

文件：218.86 Kbytes 页数：5 Pages

Bourns

伯恩斯

Three layer contacting process with nickel barrier prevents leaching and provides excellent solderability

文件：218.86 Kbytes 页数：5 Pages

Bourns

伯恩斯

Surface Mounted Resistors

文件：165.68 Kbytes 页数：3 Pages

WELWYN

Surface Mounted Resistors

文件：441.14 Kbytes 页数：3 Pages

TTELEC

厚膜芯片电阻

厚膜芯片电阻由印刷在陶瓷基板上的厚膜电阻层制成。厚膜电阻层是金属氧化物的混合物。表面贴装芯片电阻具有电镀锡（Sn）外部端子，用于电路板焊接。电阻组件由环氧树脂涂层保护。 \n符合RoHS规范*\n适用于多数的焊接工艺\n纸带和滚动条标准包装\n超低铅（Pb）含量*\n高压\n高功率\n耐浪涌\n抗硫化;

Bourns

伯恩斯

Evaluation Board Rev 5.0 for the Si2493/57/34/15/04

Description The global Si2493/57/34/15/04-EVB evaluation board Rev 5.0 provides the system designer an easy way of evaluating the Si2493/57/34/15/04 ISOmodem®. The Si2493/57/34/15/04-EVB consists of a motherboard with a power supply, an RS-232 and USB interface, other ease-of-use features, and a

文件：684.43 Kbytes 页数：36 Pages

SILABS

芯科科技

PROSLIC® SINGLE-CHIP FXS SOLUTION WITH INTEGRATED SERIAL INTERFACE (ISI)

Si32172/3/5 Features  Complete FXS solution in 5 x 7 mm  3-wire ISI combines PCM, SPI, and interrupt data  Performs all BORSCHT functions  Ideal for short to medium loops  Global programmability  Internal balanced or unbalanced ringing  Patented low power ringing  Simplified conf

文件：616.03 Kbytes 页数：46 Pages

SKYWORKS

思佳讯

SINGLE-CHIP DUAL PROSLIC®

Si32260/1 Features  Two complete FXS channels in a single 6 x 8 mm or 8 x 8 mm package  Performs all BORSCHT functions  Ideal for short- or long-loop applications  Ultra low power consumption  Internal balanced or unbalanced ringing  Patented low power ringing  Adaptive ringing  S

文件：1.2334 Mbytes 页数：59 Pages

SKYWORKS

思佳讯