No Sound or Vibration

文件：582.99 Kbytes 页数：2 Pages

LSTD

莱尔德

PELTIER MODULE

FEATURES • arcTEC™ structure • enhanced reliability for high thermal cycling • superior thermal performance • silicon sealed • wide ΔT max • precise temperature control • solid state construction

文件：503.11 Kbytes 页数：5 Pages

SAMESKY

Power Transistor NPN - Darlington Chip

PROCESS DETAILS Process EPITAXIAL BASE Die Size 195 X 195 MILS Die Thickness 12 MILS Base Bonding Pad Area 29 X 29 MILS Emitter Bonding Pad Area 61 X 35 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Ti/Ni/Au - Ni-6,000Å; Au-6,000Å

文件：207.46 Kbytes 页数：2 Pages

CENTRAL

PELTIER MODULE

FEATURES • micro size (less than 10 x 10 mm) • wide ΔT max • Qmax up to 1.7 W • Au plating available, suitable for soldering • precise temperature control • solid state construction

文件：710.78 Kbytes 页数：5 Pages

SAMESKY

PELTIER MODULE

FEATURES • micro size (less than 10 x 10 mm) • wide ΔT max • Qmax up to 1.7 W • Au plating available, suitable for soldering • precise temperature control • solid state construction

文件：710.78 Kbytes 页数：5 Pages

SAMESKY

PELTIER MODULE

FEATURES • micro size (less than 10 x 10 mm) • wide ΔT max • Qmax up to 1.7 W • Au plating available, suitable for soldering • precise temperature control • solid state construction

文件：710.78 Kbytes 页数：5 Pages

SAMESKY

PELTIER MODULE

文件：496.86 Kbytes 页数：4 Pages

CUI

PELTIER MODULE

文件：515.01 Kbytes 页数：5 Pages

CUI

PELTIER MODULE

文件：515.01 Kbytes 页数：5 Pages

CUI

Compact geometric sizes

文件：219.79 Kbytes 页数：2 Pages

LSTD

莱尔德