CD326x Audio Interface Transmitter for Specially Enabled Headsets

1 Features • Compatible with specially enabled audio interfaces (iPhone® and iPad®) • Low quiescent current – Button mode (microphone not in use): 3μA – Tone mode (microphone in use): 110μA • Miniature DSBGA (YZP) package • ESD performance – Human body model: 2000V – Charged device model:

文件：1.4375 Mbytes 页数：35 Pages

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PROCESS DETAILS Die Size 33.5 x 25.6 MILS Die Thickness 5.5 MILS Gate Bonding Pad Area 4.7 x 4.7 MILS Source Bonding Pad Area 20 x 12 MILS Top Side Metalization Al-Si - 35,000Å Back Side Metalization Au - 12,000Å

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