PowerSpan II??User Manual

文件：2.02448 Mbytes 页数：439 Pages

IDT

PowerSpan II??User Manual

文件：2.02448 Mbytes 页数：439 Pages

IDT

PowerSpan II??User Manual

文件：2.02448 Mbytes 页数：439 Pages

IDT

QSpan II??PowerQUICC-to-PCI Bridge Product Brief

文件：83.91 Kbytes 页数：2 Pages

IDT

CMOS AccelArray™

■ DESCRIPTION\nAccelArrayTM* is a new structured ASIC family, offering short development time, and low development cost with pre-diffused IP macros into base masters and pre-designed common 3 to 4 metal layers out of 6 to 7 layers. By using 0.11 µm CMOS process technology, the devices can support 6 • High-speed, large scale ASIC produced in short development time:\n  TAT = One third compared with Standard Cell ASICs (target value)\n• Uses an architecture that simplifies physical design tasks.\n• Pre-designed common masters with IR-drop free.\n• Pre-designed test circuit insertion to reduce tes;

Fujitsu

富士通

VME to PCI Bridge

The CA91C142D (Universe II) is the industry's leading high-performance PCI to VME interconnect. It is fully compliant with the VME64 bus standard, and is tailored to support advanced PCI processors and peripherals. With a zero wait state implementation for write transactions, and the capability to s • High performance 64-bit VME to PCI bus interconnect\n• Industry-proven, reliable PCI to VME bridge\n• Fully compliant, 32 or 64-bit, 33 MHz PCI bus interconnect\n• Integral FIFOs for write posting to maximize bandwidth utilization\n• Programmable DMA controller with Linked-List mode\n• Flexible in;

Renesas

瑞萨

Memory Controller

The PowerPro™ delivers memory control support for PowerPC® processors (MPC750, MPC740) and the IDT PowerPC-to-PCI bus switch, PowerSpan™. The PowerPro is designed to leverage the switched PCI architecture of PowerSpan II in PowerPC applications. Processor (60x) Bus Interface (64-bit/100 MHz)\nSDRAM Interface – 64-bit data bus, 72-bit data bus with ECC\nFLASH/ROM Interface\nDual UARTs\nI2C Interface\nInterrupt Controller;

Renesas

瑞萨

包装：散装 类别：电缆，电线 - 管理 热缩套，帽盖 描述：HEAT SHRINK COMPONENTS

TE Connectivity Aerospace, Defense and Marine

包装：散装 类别：电缆，电线 - 管理 热缩套，帽盖 描述：HEAT SHRINK COMPONENTS

TE Connectivity Aerospace, Defense and Marine

包装：线轴 类别：电缆，电线 - 管理 标签，标记 描述：LABEL HEAT SHRINKABLE

TE Connectivity Raychem Cable Protection