丝印：WB；Package：SOD-123；SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC-

文件：122.25 Kbytes 页数：5 Pages

DIODES

美台半导体

1/2 Watt ZEBER DIODES Planar Die Construction

Features: * Planar Die Construction * 500mW Power Dissipation on Ceramic PCB * General Purpose Medium Current * Ideally Suited for Automated Assembly Process

文件：136.69 Kbytes 页数：2 Pages

FCI

富加宜

410 mW Zener Diodes 2.4 to 39 Volts

Features • Planar Die Construction • 500mW Power Dissipation on Ceramic PCB • General Purpose Medium Current • Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/RoHS Compliant(P Suffix designates RoH

文件：407.95 Kbytes 页数：4 Pages

MCC

500mW, 5 Tolerance SMD Zener Diode

FEATURES - Wide zener voltage range selection : 2.4V to 75V - Surface Mount Device Type - Moisture sensitivity level 1 - Pb free and RoHS compliant - Green compound (Halogen free) with suffix G on packing code and prefix G on date code - VZ Tolerance Selection of ±5 - Matte Tin(Sn) lead fin

文件：145.06 Kbytes 页数：3 Pages

TSC

台湾半导体

Surface Mount Zener Diodes

Features: * 500mw Power Dissipation * Ideal for Surface Mountted Application * Zener Breakdown Voltage Range 2.4V to 51V

文件：106.42 Kbytes 页数：3 Pages

WEITRON

Surface mount zener diode

FEATURES ● Planar die construction. ● 500mW power dissipation on ceramic PCB. ● General purpose, medium current. ● Ideally suited for automated assembly processes. ● The Plastic Material Carries U/L Recognition 94V-0. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

文件：232.92 Kbytes 页数：4 Pages

BILIN

银河微电

Surface mount zener diode

FEATURES ● Planar die construction. ● 500mW power dissipation on ceramic PCB. ● General purpose, medium current. ● Ideally suited for automated assembly processes. ● The Plastic Material Carries U/L Recognition 94V-0. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

文件：174.63 Kbytes 页数：4 Pages

BILIN

银河微电

SURFACE MOUNT ZENER DIODE

Features ● Planar Die Construction ● 500mW Power Dissipation on Ceramic PCB ● General Purpose, Medium Current ● Ideally Suited for Automated Assembly Processes

文件：1.11216 Mbytes 页数：3 Pages

DIOTECH

ZENER DIODE

ZENER DIODE FEATURES： ● Planar Die Construction ● 350mW Power Dissipation on Ceramic PCB ● General Purpose, Medium Current ● Ideally Suited for Automated Assembly Processes ● Available in Lead Free Version

文件：976.45 Kbytes 页数：5 Pages

JIANGSU

长电科技

Surface Mount Zener Diodes

Features ● Planar Die Construction ● 500mW Power Dissipation on Ceramic PCB ● General Purpose, Medium Current

文件：50.06 Kbytes 页数：2 Pages

KEXIN

科信电子