丝印：F3；Package：SOT8015；65 V, 100 mA NPN general-purpose transistor

Features and benefits • High power dissipation capability • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm

文件：229.4 Kbytes 页数：12 Pages

NEXPERIA

安世

65 V, 100 mA PNP general-purpose transistor

Features and benefits • High power dissipation capability • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm

文件：233.1 Kbytes 页数：12 Pages

NEXPERIA

安世

丝印：F3；Package：SOT8015；65 V, 100 mA NPN general-purpose transistor

Features and benefits • High power dissipation capability • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • Qualified according to AEC-Q101 and recommended for use in automotive a

文件：230.09 Kbytes 页数：12 Pages

NEXPERIA

安世

65 V, 100 mA PNP general-purpose transistor

Features and benefits • High power dissipation capability • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • Qualified according to AEC-Q101 and recommended for use in automotive a

文件：248.67 Kbytes 页数：12 Pages

NEXPERIA

安世

45 V, 100 mA NPN general-purpose transistor

NPN general-purpose transistor in an ultra small DFN1110D-3 (SOT8015) leadless Surface-Mounted Device (SMD) plastic package with side-wettable flanks.\nTable 1. Product overview Type number\n Package\n PNP complement:\n Nexperia\n JEDEC\n BC846AQB\n SOT8015\n MO-340BA\n BC • High power dissipation capability\n• Suitable for Automatic Optical Inspection (AOI) of solder joint\n• Smaller footprint compared to conventional leaded SMD packages\n• Low package height of 0.5 mm;

Nexperia

安世

45 V, 100 mA NPN general-purpose transistor

NPN general-purpose transistor in an ultra small DFN1110D-3 (SOT8015) leadless Surface-Mounted Device (SMD) plastic package with side-wettable flanks.\nTable 1. Product overview Type number\n Package\n PNP complement:\n Nexperia\n JEDEC\n BC846AQB-Q\n SOT8015\n MO-340BA\n • High power dissipation capability\n• Suitable for Automatic Optical Inspection (AOI) of solder joint\n• Smaller footprint compared to conventional leaded SMD packages\n• Low package height of 0.5 mm\n• Qualified according to AEC-Q101 and recommended for use in automotive applications;

Nexperia

安世

Package：3-XDFN 裸露焊盘；包装：散装 类别：分立半导体产品 晶体管 - 双极性晶体管（BJT）- 单个 描述：SMALL SIGNAL BIPOLAR IN DFN PACK

Nexperia USA Inc.

Package：3-XDFN 裸露焊盘；包装：散装 类别：分立半导体产品 晶体管 - 双极性晶体管（BJT）- 单个 描述：SMALL SIGNAL BIPOLAR IN DFN PACK

Nexperia USA Inc.