Package：3-XDFN 裸露焊盘；包装：散装 类别：分立半导体产品 晶体管 - 双极性晶体管（BJT）- 单个 描述：SMALL SIGNAL BIPOLAR IN DFN PACK

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

65 V, 100 mA NPN general-purpose transistor

Features and benefits • High power dissipation capability • High voltage (max. 65 V) • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • AEC-Q101 qualified

文件：241.5 Kbytes 页数：12 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

65 V, 100 mA PNP general-purpose transistor

Features and benefits • High power dissipation capability • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm

文件：235.89 Kbytes 页数：12 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

65 V, 100 mA NPN general-purpose transistor

Features and benefits • High power dissipation capability • High voltage (max. 65 V) • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • Qualified according to AEC-Q101 and recomme

文件：249.37 Kbytes 页数：12 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司