BAS16VTB6_V01

SURFACE MOUNT SWITCHING DIODES

FEATURES Fastswitchingspeed. SurfacemountpackageIdeallySuitedforAutomaticinsertion HighConductance LeadfreeincompliancewithEURoHS2.0 GreenmoldingcompoundasperIEC61249standard

BAS16VTWPT

FAST SWITCHING DIODE ARRAY VOLTAGE 75 Volts CURRENT 150 mAmpere

FEATURE *Smallsurfacemountingtype.(SOT-563) *Highspeed.(TRR=1.5nSecTyp.) *Suitableforhighpackingdensity. *Maximumtotalpowerdisspationis200mW. *Peakforwardcurrentis300mA. *Leadfreedevices APPLICATION *Ultrahighspeedswitching *Forgeneralpurposeswitching

BAS16VV

SURFACE MOUNT SWITCHING DIODE ARRAY

Features FastSwitchingSpeed LowForwardVoltage:Maximumof0.715Vat1mA FastReverseRecovery:Maximumof4ns LowCapacitance:Maximumof1.5pF LowLeakageCurrent Ultra-SmallSurfaceMountPackage ThermallyEfficientCopperAlloyLeadframeforHighPower Dissipation T

BAS16VV

Marking：53；Package：SOT666；High-speed switching diode

1.Generaldescription High-speedswitchingdiode,encapsulatedinaultrasmallandflatleadSOT666Surface-Mounted Device(SMD)plasticpackage. 2.Featuresandbenefits •Highswitchingspeed:trr≤4ns •Lowcapacitance •Lowleakagecurrent •Reversevoltage:VR≤100V •Repetiti

BAS16VV

Marking：53；Package：SOT666；High-speed switching diodes

Featuresandbenefits Highswitchingspeed:trr4ns Lowleakagecurrent Repetitivepeakreversevoltage: VRRM100V AEC-Q101qualified Lowcapacitance Reversevoltage:VR100V SmallSMDplasticpackages

BAS16VV-7

Marking：KJP；Package：SOT563；SURFACE MOUNT SWITCHING DIODE ARRAY

Features FastSwitchingSpeed LowForwardVoltage:Maximumof0.715Vat1mA FastReverseRecovery:Maximumof4ns LowCapacitance:Maximumof1.5pF LowLeakageCurrent Ultra-SmallSurfaceMountPackage ThermallyEfficientCopperAlloyLeadframeforHighPower Dissipation T

BAS16VVQ

SURFACE MOUNT SWITCHING DIODE ARRAY

Features FastSwitchingSpeed LowForwardVoltage:Maximumof0.715Vat1mA FastReverseRecovery:Maximumof4ns LowCapacitance:Maximumof1.5pF LowLeakageCurrent TripleIsolatedFastSwitchingDiodeArray Ultra-SmallSurfaceMountPackage ThermallyEfficientCopperAl

BAS16VVQ-7

Marking：KJP；Package：SOT563；SURFACE MOUNT SWITCHING DIODE ARRAY

Features FastSwitchingSpeed LowForwardVoltage:Maximumof0.715Vat1mA FastReverseRecovery:Maximumof4ns LowCapacitance:Maximumof1.5pF LowLeakageCurrent TripleIsolatedFastSwitchingDiodeArray Ultra-SmallSurfaceMountPackage ThermallyEfficientCopperAl

BAS16VY

Marking：16；Package：TSSOP6；High-speed switching diode

1.Generaldescription High-speedswitchingdiode,encapsulatedinaverysmallSOT363(SC-88)Surface-Mounted Device(SMD)plasticpackage. 2.Featuresandbenefits •Highswitchingspeed:trr≤4ns •Lowcapacitance •Lowleakagecurrent •Reversevoltage:VR≤100V •Repetitivepeak

BAS16VY

Marking：16；Package：SC-88；High-speed switching diodes

Featuresandbenefits Highswitchingspeed:trr4ns Lowleakagecurrent Repetitivepeakreversevoltage: VRRM100V AEC-Q101qualified Lowcapacitance Reversevoltage:VR100V SmallSMDplasticpackages