丝印：TP；Package：SOT-563；SURFACE MOUNT SWITCHING DIODES

FEATURES Fast switching speed. Surface mount package Ideally Suited for Automatic insertion High Conductance Lead free in compliance with EU RoHS 2.0 Green molding compound as per IEC 61249 standard

文件：531.84 Kbytes 页数：5 Pages

PANJIT

強茂

SURFACE MOUNT SWITCHING DIODES

FEATURES Fast switching speed. Surface mount package Ideally Suited for Automatic insertion High Conductance Lead free in compliance with EU RoHS 2.0 Green molding compound as per IEC 61249 standard

文件：531.84 Kbytes 页数：5 Pages

PANJIT

強茂

SURFACE MOUNT SWITCHING DIODES

FEATURES Fast switching speed. Surface mount package Ideally Suited for Automatic insertion High Conductance Lead free in compliance with EU RoHS 2.0 Green molding compound as per IEC 61249 standard

文件：531.84 Kbytes 页数：5 Pages

PANJIT

強茂

SURFACE MOUNT SWITCHING DIODES

FEATURES Fast switching speed. Surface mount package Ideally Suited for Automatic insertion High Conductance Lead free in compliance with EU RoHS 2.0 Green molding compound as per IEC 61249 standard

文件：531.84 Kbytes 页数：5 Pages

PANJIT

強茂

FAST SWITCHING DIODE ARRAY VOLTAGE 75 Volts CURRENT 150 mAmpere

FEATURE * Small surface mounting type. (SOT-563) * High speed. (TRR= 1.5nSec Typ.) * Suitable for high packing density. * Maximum total power disspation is 200mW. * Peak forward current is 300mA. * Lead free devices APPLICATION * Ultra high speed switching * For general purpose switching

文件：79.69 Kbytes 页数：2 Pages

CHENMKO

力勤

SURFACE MOUNT SWITCHING DIODE ARRAY

Features  Fast Switching Speed  Low Forward Voltage: Maximum of 0.715V at 1mA  Fast Reverse Recovery: Maximum of 4ns  Low Capacitance: Maximum of 1.5pF  Low Leakage Current  Ultra-Small Surface Mount Package  Thermally Efficient Copper Alloy Leadframe for High Power Dissipation  T

文件：598.89 Kbytes 页数：5 Pages

DIODES

美台半导体

High-speed switching diodes

General description High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Features ■ High switching speed: trr ≤ 4 ns ■ Low capacitance ■ Low leakage current ■ Reverse voltage: VR ≤ 100 V ■ Repetitive peak reverse voltage: VRRM ≤ 1

文件：150.73 Kbytes 页数：20 Pages

恩XP

Triple high-speed switching diodes

General description High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Features ■ High switching speed: trr ≤ 4 ns ■ Low capacitance ■ Low leakage current ■ Reverse voltage: VR ≤ 100 V ■ Repetitive peak reverse voltage: VRRM ≤ 1

文件：81.04 Kbytes 页数：12 Pages

恩XP

High-speed switching diodes

General description High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Features ■ High switching speed: trr ≤ 4 ns ■ Low capacitance ■ Low leakage current ■ Reverse voltage: VR ≤ 100 V ■ Repetitive peak reverse voltage: VRRM ≤ 1

文件：150.73 Kbytes 页数：20 Pages

恩XP

High-speed switching diodes

General description High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages Applications  High-speed switching  General-purpose switching

文件：773.63 Kbytes 页数：21 Pages

NEXPERIA

安世