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BURNDY_YF2012IW

ElectCuSingleInsulWireFerrules,SmoothFunnelEntry,20AWG,0.71L,TinPlated,White,ForuseonCuCond.

HUBBELL

HUBBELL INCORPORATED

BURNDY_YF2012UI

CuAlloyBareFerrule,SmoothFunnelEntry,20AWG,0.47L,Seamlessbbl,TinPlated,ForUseOnCuCond.

HUBBELL

HUBBELL INCORPORATED

C2012

CAPACITORS

etc2List of Unclassifed Manufacturers

etc未分类制造商etc2未分类制造商

C2012

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

C2012

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

C2012

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

C2012

MULTILAYERCERAMICCHIPCAPACITORS

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

C2012

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

C2012

MultilayerCeramicChipCapacitorsGeneraluse

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

C2012

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

供应商型号品牌批号封装库存备注价格
APLUS
23+
原厂原包
19960
只做进口原装 终端工厂免费送样
询价
24+
N/A
56000
一级代理-主营优势-实惠价格-不悔选择
询价
TinyCircuits
24+
SMD
17900
开发板和工具包-ARMTinyScreen+(OLED
询价
ASMEDIA
24+
QFP
20000
全新原厂原装,进口正品现货,正规渠道可含税!!
询价
ASMEDIA
23+
QFP
5000
专注配单,只做原装进口现货
询价
ASMEDIA
23+
QFP
5000
专注配单,只做原装进口现货
询价
AD
SSOP
2
询价
ADI/亚德诺
22+
66900
原封装
询价
ADI/亚德诺
2511
原封装
66900
电子元器件采购降本 30%!盈慧通原厂直采,砍掉中间差价
询价
ADI/亚德诺
23+
SOP24
12000
原厂授权代理,海外优势订货渠道。可提供大量库存,详
询价
更多ASM2012C供应商 更新时间2025-7-14 15:01:00