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C2012

MULTILAYER CERAMIC CHIP CAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化(中国)投资有限公司

TDK

C2012

Multilayer Ceramic Chip Capacitors General use

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化(中国)投资有限公司

TDK

C2012

MULTILAYER CERAMIC CHIP CAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

东电化(中国)投资有限公司

TDK

C2012

MULTILAYER CERAMIC CHIP CAPACITORS Commercial grade, general (Up to 75V)

■SERIESOVERVIEW GeneraltypeCseriesisasurface-mountedcomponent,whichmultilayerdielectricsandinnerelectrodesarestackedalternately.Themonolithic structureensuressuperiormechanicalstrengthandhighreliability.Also,outstandingfrequencycharacteristicssuchaslowESRandlo

TDKTDK Corporation

东电化(中国)投资有限公司

TDK

C2012

MULTILAYER CERAMIC CHIP CAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化(中国)投资有限公司

TDK

C2012

MULTILAYER CERAMIC CHIP CAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化(中国)投资有限公司

TDK

C2012

MULTILAYER CERAMIC CHIP CAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化(中国)投资有限公司

TDK

C2012

MULTILAYER CERAMIC CHIP CAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化(中国)投资有限公司

TDK

C2012

Multilayer Ceramic Chip Capacitors General use

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化(中国)投资有限公司

TDK

C2012

MULTILAYER CERAMIC CHIP CAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化(中国)投资有限公司

TDK

C2012

Multilayer Ceramic Chip Capacitors General use

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化(中国)投资有限公司

TDK

C2012

MULTILAYER CERAMIC CHIP CAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

东电化(中国)投资有限公司

TDK

C2012

MULTILAYER CERAMIC CHIP CAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

东电化(中国)投资有限公司

TDK

C2012

MULTILAYER CERAMIC CHIP CAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

东电化(中国)投资有限公司

TDK

C2012

MULTILAYER CERAMIC CHIP CAPACITORS

TDKTDK Corporation

东电化(中国)投资有限公司

TDK

C2012

MULTILAYER CERAMIC CHIP CAPACITORS

TDKTDK Corporation

东电化(中国)投资有限公司

TDK

C2012

HEYCo-molded Liquid Tight Break-Thru Plugs

etc2List of Unclassifed Manufacturers

etc2未分类制造商

etc2

C2012

Multilayer Ceramic Chip Capacitors

TDKTDK Corporation

东电化(中国)投资有限公司

TDK

C2012

MULTILAYER CERAMIC CHIP CAPACITORS

TDKTDK Corporation

东电化(中国)投资有限公司

TDK

C2012

HEYCo-molded™ Liquid Tight Break-Thru Plugs

Heyco

Heyco

Heyco

产品属性

  • 产品编号:

    C2012

  • 制造商:

    Heyco Products Corporation

  • 类别:

    电缆,电线 - 管理 > 衬套,索环

  • 包装:

  • 衬套、扣眼类型:

    扣眼

  • 配套使用/相关产品:

    线缆,导线

  • 面板厚度:

    0.063"(1.60mm)

  • 面板开口尺寸:

    圆形 - 0.625"(15.88mm)

  • 材料:

    热塑性弹性体(TPE)和聚酰胺(PA66),尼龙 6/6

  • 颜色:

    黑色

  • 材料可燃性等级:

    UL94 HB

  • 描述:

    LTBP 625-063 BLACK

供应商型号品牌批号封装库存备注价格
TDK
2017+
SOT23
21458
深圳代理原装现货进口库存(香港-日本-台湾)开17点增票
询价
A
E367
DIP-6
6
询价
NA
NA
NA
2885
原装/现货
询价
N/A
23+
80000
专注配单,只做原装进口现货
询价
N/A
23+
80000
专注配单,只做原装进口现货
询价
TDK-东电化
24+25+/26+27+
车规-陶瓷电容
83628
一一有问必回一特殊渠道一有长期订货一备货HK仓库
询价
TDK
0936
2000
优势货源原装正品
询价
QFP
950
100%原装正品!现货热价热卖!可开17%增值税票!
询价
TDK
23+
0805
12700
买原装认准中赛美
询价
TDK
2007
2000
公司优势库存 热卖中!!
询价
更多C2012供应商 更新时间2024-4-25 17:20:00