首页 >APT-2012ZGCK>规格书列表
| 零件编号 | 下载&订购 | 功能描述 | 制造商&上传企业 | LOGO |
|---|---|---|---|---|
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | TDK | ||
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | TDK | ||
CAPACITORS | etc2List of Unclassifed Manufacturers etc未分类制造商etc2未分类制造商 | etc2 | ||
MultilayerCeramicChipCapacitors | TDKTDK Corporation 东电化（中国）投资有限公司 | TDK | ||
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation 东电化（中国）投资有限公司 | TDK | ||
HEYCo-moldedLiquidTightBreak-ThruPlugs | etc2List of Unclassifed Manufacturers etc未分类制造商etc2未分类制造商 | etc2 | ||
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | TDK | ||
MULTILAYERCERAMICCHIPCAPACITORS | TDKTDK Corporation 东电化（中国）投资有限公司 | TDK | ||
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | TDK | ||
MultilayerCeramicChipCapacitorsGeneraluse Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | TDK | ||
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation 东电化（中国）投资有限公司 | TDK | ||
MultilayerCeramicChipCapacitorsGeneraluse Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | TDK | ||
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation 东电化（中国）投资有限公司 | TDK | ||
MULTILAYERCERAMICCHIPCAPACITORS | TDKTDK Corporation 东电化（中国）投资有限公司 | TDK | ||
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation 东电化（中国）投资有限公司 | TDK | ||
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation 东电化（中国）投资有限公司 | TDK | ||
MULTILAYERCERAMICCHIPCAPACITORS | TDKTDK Corporation 东电化（中国）投资有限公司 | TDK | ||
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation 东电化（中国）投资有限公司 | TDK | ||
MultilayerCeramicChipCapacitorsGeneraluse Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | TDK | ||
CeramicCapacitorsForGeneralUseSMD Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation 东电化（中国）投资有限公司 | TDK |
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
KINGBRIGT-今台 |
24+25+/26+27+ |
车规-光电器件 |
43788 |
一一有问必回一特殊渠道一有长期订货一备货HK仓库 |
询价 | ||
23+ |
N/A |
58300 |
一级代理放心采购 |
询价 | |||
MicrosemiCorporation |
2019+ |
SOT-227 |
65500 |
原装正品货到付款,价格优势! |
询价 | ||
MICROSEMI |
638 |
原装正品 |
询价 | ||||
Microsemi |
1942+ |
N/A |
908 |
加我qq或微信，了解更多详细信息,体验一站式购物 |
询价 | ||
MICROSEMI |
1809+ |
SOT-227 |
26 |
就找我吧!--邀您体验愉快问购元件! |
询价 | ||
Microsemi Corporation |
22+ |
SOT227 |
9000 |
原厂渠道,现货配单 |
询价 | ||
Microsemi Corporation |
21+ |
SOT227 |
13880 |
公司只售原装,支持实单 |
询价 | ||
Microsemi Corporation |
23+ |
SOT227 |
9000 |
原装正品，支持实单 |
询价 | ||
Microchip |
2022+ |
原厂原包装 |
8600 |
全新原装 支持表配单 中国著名电子元器件独立分销 |
询价 |
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