丝印：AH245A；Package：TVSOP；16-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS

FEATURES · Members of the Texas Instruments Widebus™ Family · State-of-the-Art EPIC-IIB™ BiCMOS Design Significantly Reduces Power Dissipation · Typical VOLP (Output Ground Bounce)

文件：504.15 Kbytes 页数：20 Pages

TI

德州仪器

丝印：AH245A；Package：TVSOP(DGV)；16-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS

FEATURES · Members of the Texas Instruments Widebus™ Family · State-of-the-Art EPIC-IIB™ BiCMOS Design Significantly Reduces Power Dissipation · Typical VOLP (Output Ground Bounce)

文件：506.47 Kbytes 页数：20 Pages

TI

德州仪器

丝印：AH245A；Package：TVSOP；16-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS

FEATURES · Members of the Texas Instruments Widebus™ Family · State-of-the-Art EPIC-IIB™ BiCMOS Design Significantly Reduces Power Dissipation · Typical VOLP (Output Ground Bounce)

文件：505.7 Kbytes 页数：20 Pages

TI

德州仪器

丝印：AH245A；Package：TVSOP；16-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS

FEATURES · Members of the Texas Instruments Widebus™ Family · State-of-the-Art EPIC-IIB™ BiCMOS Design Significantly Reduces Power Dissipation · Typical VOLP (Output Ground Bounce)

文件：505.7 Kbytes 页数：20 Pages

TI

德州仪器

丝印：AH245A；Package：TVSOP(DGV)；16-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS

FEATURES · Members of the Texas Instruments Widebus™ Family · State-of-the-Art EPIC-IIB™ BiCMOS Design Significantly Reduces Power Dissipation · Typical VOLP (Output Ground Bounce)

文件：506.47 Kbytes 页数：20 Pages

TI

德州仪器

丝印：AH238Q；Package：WQFN；SN74AHC238-Q1 Automotive 3- to 8-Line Noninverting Decoder/Demultiplexer

1 Features • AEC-Q100 qualified for automotive applications: – Device temperature grade 1: -40°C to +125°C – Device HBM ESD classification level 2 – Device CDM ESD classification level C4B • Available in wettable flank QFN package • Operating range 2V to 5.5V VCC • Low delay, 10.5ns max (VC

文件：1.77123 Mbytes 页数：27 Pages

TI

德州仪器

丝印：AH257Q；Package：WQFN；SN74AHC257-Q1 Automotive Quad 2-Input Data Selectors/Multiplexers with Three-State Non-Inverting Outputs

1 Features • AEC-Q100 qualified for automotive applications: – Device temperature grade 1: -40°C to +125°C – Device HBM ESD classification level 2 – Device CDM ESD classification level C4B • Available in wettable flank QFN package • Operating range 2V to 5.5V VCC • Low delay, 9.5ns max (VCC

文件：1.9621 Mbytes 页数：29 Pages

TI

德州仪器

包装、高速用打印头

最适用于要求高可靠性的包装打印机等。 ·Ultra small mold type (VMN2M)\n·High reliability\n·Low VF;

ROHM

罗姆

For Packaging High Printers AH Series

ROHM

罗姆

Package：轴向，盒；包装：散装 类别：电阻器 底座安装电阻器 描述：AH200 10 5% E66

Vishay Huntington Electric Inc.