DIFFERENTIAL PRESSURE SWITCH

PRODUCT DESCRIPTION The plated housing contains a diaphragm, a calibration spring and a snap-acting SPDT switch. The sample connections located on each side of the diaphragm accept 6.35mm (0.25”) OD tubing via the integral compression ferrule and nut or barbed fitting. An enclosure cover gu

文件：199.08 Kbytes 页数：1 Pages

GREYSTONE

PFC CAPACITOR

文件：91.37 Kbytes 页数：1 Pages

OKAYA

丝印：AFs；Package：SOT23；NPN Silicon AF Transistors

文件：105.25 Kbytes 页数：11 Pages

Infineon

英飞凌

丝印：AFS；Package：TSOT23-6；Primary-Side-Control, Offline LED Controller with Active PFC

文件：1.20538 Mbytes 页数：18 Pages

MPS

美国芯源

丝印：AFS；Package：SOT-5X3；Single Schmitt-Trigger Inverter Gate

文件：1.41444 Mbytes 页数：28 Pages

TI

德州仪器

丝印：AFS；Package：SOT-5X3；Single Schmitt-Trigger Inverter Gate

文件：1.41444 Mbytes 页数：28 Pages

TI

德州仪器

Terrestrial FPGA and SoC Product Catalog

Features and Benefits High Capacity • 15 k to 1 M System Gates • Up to 144 kbits of True Dual-Port SRAM • Up to 300 User I/Os Reprogrammable Flash Technology • 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process • Instant On Level 0 Support • Single-Chip Solution

文件：1.89333 Mbytes 页数：27 Pages

Microsemi

美高森美

Terrestrial FPGA and SoC Product Catalog

Features and Benefits High Capacity • 15 k to 1 M System Gates • Up to 144 kbits of True Dual-Port SRAM • Up to 300 User I/Os Reprogrammable Flash Technology • 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process • Instant On Level 0 Support • Single-Chip Solution

文件：1.89333 Mbytes 页数：27 Pages

Microsemi

美高森美

SURFACE MOUNT GLASS PASSIVATED RECTIFIER

FEATURES •For surface mounted applications. •Low reverse leakage current •Low forward voltage drop • High current capability •Lead Free Finis h; RoHS Compliant (Notes 1 & 2) •Halogen and Antimony Free. “Green” Device (Note 3) •For automotive applications requiring specific change control (

文件：583.56 Kbytes 页数：4 Pages

DIODES

美台半导体

Terrestrial FPGA and SoC Product Catalog

Features and Benefits High Capacity • 15 k to 1 M System Gates • Up to 144 kbits of True Dual-Port SRAM • Up to 300 User I/Os Reprogrammable Flash Technology • 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process • Instant On Level 0 Support • Single-Chip Solution

文件：1.89333 Mbytes 页数：27 Pages

Microsemi

美高森美