Debug Header Specification

文件：782.59 Kbytes 页数：78 Pages

MICROCHIP

微芯科技

Debug Header Specification

文件：782.59 Kbytes 页数：78 Pages

MICROCHIP

微芯科技

丝印：AC244Q；Package：TSSOP；SN74AC244-Q1 Automotive Octal Buffers or Drivers With 3-State Outputs

1 Features • AEC-Q100 qualified for automotive applications: – Device temperature grade 1: -40°C to +125°C – Device HBM ESD classification level 2 – Device CDM ESD classification level C4B • Available in wettable flank QFN (RKS) package • Wide operating range of 1.5V to 6V • Inputs accept v

文件：1.66316 Mbytes 页数：32 Pages

TI

德州仪器

丝印：AC244Q；Package：VQFN；SN74AC244-Q1 Automotive Octal Buffers or Drivers With 3-State Outputs

1 Features • AEC-Q100 qualified for automotive applications: – Device temperature grade 1: -40°C to +125°C – Device HBM ESD classification level 2 – Device CDM ESD classification level C4B • Available in wettable flank QFN (RKS) package • Wide operating range of 1.5 V to 6 V • Inputs accept

文件：1.49849 Mbytes 页数：28 Pages

TI

德州仪器

丝印：AC244Q；Package：VQFN；SN74AC244-Q1 Automotive Octal Buffers or Drivers With 3-State Outputs

1 Features • AEC-Q100 qualified for automotive applications: – Device temperature grade 1: -40°C to +125°C – Device HBM ESD classification level 2 – Device CDM ESD classification level C4B • Available in wettable flank QFN (RKS) package • Wide operating range of 1.5V to 6V • Inputs accept v

文件：1.66316 Mbytes 页数：32 Pages

TI

德州仪器

Processor Extension Pak for PIC24F16KA102Family

Microchip

微芯科技

包装：管件 类别：开发板，套件，编程器 配件 描述：PAK PERFORMANCE MPLAB REAL ICE

MICROCHIP

微芯科技

包装：盒 类别：开发板，套件，编程器 配件 描述：TEST BD MPLAB REAL ICE LOOPBACK

MICROCHIP

微芯科技

包装：盒 类别：开发板，套件，编程器 配件 描述：KIT MPLAB REAL ICE ISOLATOR

MICROCHIP

微芯科技