98AON97727G中文资料安森美半导体数据手册PDF规格书

This TO−277 trench Schottky rectifier provides fast switching

performance in a compact thermally efficient package. The TO−277

package provides an excellent alternative to the DPAK, offering

thermal performance nearly as good in a package occupying less than

half the board space. Its low profile makes it a good option for flat

panel display and other applications with limited vertical clearance.

The device offers low leakage over temperature making it a good

match for applications requiring low quiescent current.

特性 Features

• Package Provides Capability of Inspection and Probe After Board

Mounting

• Low Forward Voltage Drop

• 175°C Operating Junction Temperature

• NRV Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q101

Qualified and PPAP Capable

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

Mechanical Characteristics:

• Case: Epoxy, Molded

• Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in.

• Lead Finish: 100% Matte Sn (Tin)

• Lead and Mounting Surface Temperature for Soldering Purposes:

260°C Max. for 10 Seconds

• Device Meets MSL 1 Requirements

Applications

• Excellent Alternative to DPAK in Space−Constrained Automotive

Applications

• Low Leakage for Higher Temperature Operation

• Output Rectification in Compact Portable Consumer Applications

• Freewheeling Diode used with Inductive Loads