Schottky Barrier Rectifier, Trench-based

This TO−277 trench Schottky rectifier provides fast switching performance in a compact thermally efficient package. The TO−277 package provides an excellent alternative to the DPAK, offering thermal performance nearly as good in a package occupying less than half the board space. Its low profi

文件：214.37 Kbytes 页数：6 Pages

ONSEMI

安森美半导体

Schottky Barrier Rectifier, Trench-based

This TO−277 trench Schottky rectifier provides fast switching performance in a compact thermally efficient package. The TO−277 package provides an excellent alternative to the DPAK, offering thermal performance nearly as good in a package occupying less than half the board space. Its low profi

文件：219.06 Kbytes 页数：6 Pages

ONSEMI

安森美半导体

Schottky Barrier Rectifier, Trench-based

This TO−277 trench Schottky rectifier provides fast switching performance in a compact thermally efficient package. The TO−277 package provides an excellent alternative to the DPAK, offering thermal performance nearly as good in a package occupying less than half the board space. Its low profi

文件：219.08 Kbytes 页数：6 Pages

ONSEMI

安森美半导体

Schottky Barrier Rectifier, Trench-based

This TO−277 trench Schottky rectifier provides fast switching performance in a compact thermally efficient package. The TO−277 package provides an excellent alternative to the DPAK, offering thermal performance nearly as good in a package occupying less than half the board space. Its low profi

文件：204.75 Kbytes 页数：6 Pages

ONSEMI

安森美半导体

Schottky Barrier Rectifier, Trench-based

This TO−277 trench Schottky rectifier provides fast switching performance in a compact thermally efficient package. The TO−277 package provides an excellent alternative to the DPAK, offering thermal performance nearly as good in a package occupying less than half the board space. Its low profi

文件：216.1 Kbytes 页数：6 Pages

ONSEMI

安森美半导体

Schottky Barrier Rectifier, Trench-based

This TO−277 trench Schottky rectifier provides fast switching performance in a compact thermally efficient package. The TO−277 package provides an excellent alternative to the DPAK, offering thermal performance nearly as good in a package occupying less than half the board space. Its low profi

文件：202.72 Kbytes 页数：6 Pages

ONSEMI

安森美半导体