Audio, Control & Instrument, #20-9pr, PO, Indiv. Foil, PVC Jkt, CM

Product Description Audio, Control & Instrument Cable, 20 AWG stranded (7x28) tinned copper conductors, polypropylene insulation, 9 twisted pairs, individually shielded with Beldfoil® (100 coverage), 22 AWG stranded tinned copper drain wire, overall PVC jacket.

文件：211.7 Kbytes 页数：2 Pages

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百通

Audio, Control & Instrument, #20-9pr, PO, Indiv. Foil, PVC Jkt, CM

Product Description Audio, Control & Instrument Cable, 20 AWG stranded (7x28) tinned copper conductors, polypropylene insulation, 9 twisted pairs, individually shielded with Beldfoil® (100 coverage), 22 AWG stranded tinned copper drain wire, overall PVC jacket.

文件：211.7 Kbytes 页数：2 Pages

BELDEN

百通

Audio, Control & Instrument, #20-11pr, PO, Indiv. Foil, PVC Jkt, CM

Product Description Audio, Control & Instrument Cable, 20 AWG stranded (7x28) tinned copperconductors, polypropylene insulation, 11 twisted pairs, individually shielded with Beldfoil® (100 coverage), 22 AWG stranded tinned copperdrain wire, overall PVC jacket.

文件：169.09 Kbytes 页数：2 Pages

BELDEN

百通

Audio, Control & Instrument, #20-11pr, PO, Indiv. Foil, PVC Jkt, CM

Product Description Audio, Control & Instrument Cable, 20 AWG stranded (7x28) tinned copperconductors, polypropylene insulation, 11 twisted pairs, individually shielded with Beldfoil® (100 coverage), 22 AWG stranded tinned copperdrain wire, overall PVC jacket.

文件：169.09 Kbytes 页数：2 Pages

BELDEN

百通

Self-Contained Power Connector (SCPC)

Description: Self-Contained Power Connector for 2 Circuit Round Cable with Ground, 14 AWG, Insulation Diameter 15.24mm Application Wire-to-Wire

文件：46.69 Kbytes 页数：2 Pages

MOLEX

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iGrid Wire-to-Board Dual-Row System

Description: 2.00mm Pitch iGrid Wire-to-Board Header, Dual Row, Vertical, Gold (Au) Plating, with PCB Locator, 14 Circuits Application Signal, Wire-to-Board

文件：29.86 Kbytes 页数：2 Pages

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Milli-Grid Connector System

Description: 2.00mm Pitch Milli-Grid Receptacle, Surface Mount, Bottom Entry, 0.38μm Gold (Au) Selective, 6 Circuits, without Pick-and-Place Cap, Tube, Lead-Free Application Board-to-Board, Signal

文件：34.86 Kbytes 页数：2 Pages

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Milli-Grid™ Connector System

Description: 2.00mm Pitch Milli-Grid™ Receptacle, Side Entry, Through Hole, 0.38μm Gold (Au) Selective, 22 Circuits, Lead-Free Application Board-to-Board, Signal

文件：37.64 Kbytes 页数：2 Pages

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zQSFP® Interconnect System

Description: zQuad Small Form Factor Pluggable Plus (zQSFP+) Stacked Integrated 2-by-1 Connector and Cage with Elastomeric Gasket, Gold (Au) Over Nickel Plated, Up/Down Light Pipe Application Board-to-Board, Module-to-Board, Wire-to-Board

文件：42.87 Kbytes 页数：2 Pages

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Mega-Fit Power Connectors

Description: Mega-Fit Vertical Header, 5.70mm Pitch, 3 Circuits, 1.52μm Matte Tin Plating, UL 94V-0, Glow-Wire Capable, Black Application Power, Wire-to-Board

文件：35.7 Kbytes 页数：2 Pages

MOLEX

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