丝印：953；Package：SMA；Silicon Planar Zener Diodes

FEATURES + Total power dissipation: Max. 1.5 W. + Wide zener reverse voltage range 3.6V to 200V. « Small plastic package suitable for surface mounted design.

文件：1.54737 Mbytes 页数：4 Pages

TECHPUBLIC

台舟电子

丝印：95372AM；Package：LSON-CLIP；CSD95372AQ5M Synchronous Buck NexFET™ Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 92.4% System Efficiency at 30 A • Ultra-Low Power Loss of 3.3 W at 30 A • High Frequency Operation (up to 2 MHz) • High Density - SON 5 x 6 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V

文件：712.42 Kbytes 页数：25 Pages

TI

德州仪器

丝印：95372AM；Package：LSON-CLIP(DQP)；CSD95372AQ5M Synchronous Buck NexFET™ Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 92.4% System Efficiency at 30 A • Ultra-Low Power Loss of 3.3 W at 30 A • High Frequency Operation (up to 2 MHz) • High Density - SON 5 x 6 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V

文件：712.88 Kbytes 页数：25 Pages

TI

德州仪器

丝印：95372AM；Package：LSON-CLIP；CSD95372AQ5M Synchronous Buck NexFET™ Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 92.4% System Efficiency at 30 A • Ultra-Low Power Loss of 3.3 W at 30 A • High Frequency Operation (up to 2 MHz) • High Density - SON 5 x 6 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V

文件：712.42 Kbytes 页数：25 Pages

TI

德州仪器

丝印：95372AM；Package：LSON-CLIP(DQP)；CSD95372AQ5M Synchronous Buck NexFET™ Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 92.4% System Efficiency at 30 A • Ultra-Low Power Loss of 3.3 W at 30 A • High Frequency Operation (up to 2 MHz) • High Density - SON 5 x 6 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V

文件：712.88 Kbytes 页数：25 Pages

TI

德州仪器

丝印：95372AM；Package：LSON-CLIP；CSD95372AQ5M Synchronous Buck NexFET™ Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 92.4% System Efficiency at 30 A • Ultra-Low Power Loss of 3.3 W at 30 A • High Frequency Operation (up to 2 MHz) • High Density - SON 5 x 6 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V

文件：712.42 Kbytes 页数：25 Pages

TI

德州仪器

丝印：95372BM；Package：LSON-CLIP；CSD95372BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

文件：352.22 Kbytes 页数：13 Pages

TI

德州仪器

丝印：95372BM；Package：LSON-CLIP；CSD95372BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

文件：352.22 Kbytes 页数：13 Pages

TI

德州仪器

丝印：95372BM；Package：LSON-CLIP；CSD95372BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

文件：352.22 Kbytes 页数：13 Pages

TI

德州仪器

丝印：95372BMC；Package：VSON-CLIP；CSD95372BQ5MC Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature-Compensated Bidirectional Current Sense • Analog Temperature Output

文件：384.52 Kbytes 页数：13 Pages

TI

德州仪器