5 x 7 Ceramic 6 Pad LVPECL Output

文件：141.14 Kbytes 页数：2 Pages

OSCILENT

LVPECL Output

文件：141.14 Kbytes 页数：2 Pages

OSCILENT

Inductive sensor

文件：132.13 Kbytes 页数：1 Pages

PF

倍加福

Inductive sensor

文件：121.94 Kbytes 页数：1 Pages

PF

倍加福

Inductive sensor

文件：128.1 Kbytes 页数：1 Pages

PF

倍加福

丝印：921A；Package：DO-214AC；Silicon Planar Zener Diodes

FEATURES ♦ Total power dissipation: Max. 1.5 W. ♦ Wide zener reverse voltage range 3.3V to 240V. ♦ Small plastic package suitable for surface mounted design. ♦ Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA ♦ Case: DO-214AC/SMA ♦ Terminals: Solderable per MIL-STD-750

文件：462.81 Kbytes 页数：3 Pages

YFWDIODE

佑风微

丝印：921A；Silicon Planar Zener Diodes

FEATURES • Total power dissipation: Max. 1.5 W. • Wide zener reverse voltage range 3.3V to 240V. • Small plastic package suitable for surface mounted design. MECHANICAL DATA • Case: SMA • Terminals: Solderable per MIL-STD-750, Method 2026 • Approx. Weight: 0.055g / 0.002oz

文件：550.45 Kbytes 页数：3 Pages

JUXING

广东钜兴电子

丝印：921B；Package：SMA；Silicon Planar Zener Diodes

FEATURES • Total power dissipation: Max. 1.5 W. • Wide zener reverse voltage range 3.3V to 240V. • Small plastic package suitable for surface mounted design. MECHANICAL DATA • Case: SMA • Terminals: Solderable per MIL-STD-750, Method 2026 • Approx. Weight: 0.055g / 0.002oz

文件：256.67 Kbytes 页数：3 Pages

SKTECHNOLGYSHIKE Electronics

时科广东时科微实业有限公司

丝印：921B；Package：DO-214AA；Silicon Planar Zener Diodes

FEATURES ♦ Total power dissipation: Max. 3 W. ♦ Wide zener reverse voltage range 3.3V to 200V. ♦ plastic package suitable for surface mounted design. ♦ Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA ♦ Case: DO-214AA/SMB ♦ Terminals: Solderable per MIL-STD-750, Method

文件：423.4 Kbytes 页数：4 Pages

YFWDIODE

佑风微

丝印：921B；Package：SMB；SURFACE MOUNT SILICON ZENER DIODES

Vz : 3.3 - 200 Volts, Pd : 3 Watts Features • Total power dissipation: Max. 3 W. • Wide zener reverse voltage range 3.3V to 200V. • Small plastic package suitable for surface mounted design. Mechanical Data • Case: SMB • Terminals: Solderable per MIL-STD-750, Method 2026 • Approx. Weight:

文件：661.67 Kbytes 页数：4 Pages

FS