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CSD87333Q3D

丝印:87333D;Package:VSON-CLIP;CSD87333Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Optimized for High-Duty Cycle • Up to 24 Vin • 94.7% System Efficiency at 8 A • 1.5 W PLoss at 8 A • Up to 15-A Operation • High-Frequency Operation (up to 1.5 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • L

文件:823.57 Kbytes 页数:24 Pages

TI

德州仪器

CSD87333Q3D

丝印:87333D;Package:VSON-CLIP(DPB);CSD87333Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Optimized for High-Duty Cycle • Up to 24 Vin • 94.7% System Efficiency at 8 A • 1.5 W PLoss at 8 A • Up to 15-A Operation • High-Frequency Operation (up to 1.5 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • L

文件:827.08 Kbytes 页数:25 Pages

TI

德州仪器

CSD87333Q3D.B

丝印:87333D;Package:VSON-CLIP;CSD87333Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Optimized for High-Duty Cycle • Up to 24 Vin • 94.7% System Efficiency at 8 A • 1.5 W PLoss at 8 A • Up to 15-A Operation • High-Frequency Operation (up to 1.5 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • L

文件:823.57 Kbytes 页数:24 Pages

TI

德州仪器

CSD87333Q3D.B

丝印:87333D;Package:VSON-CLIP(DPB);CSD87333Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Optimized for High-Duty Cycle • Up to 24 Vin • 94.7% System Efficiency at 8 A • 1.5 W PLoss at 8 A • Up to 15-A Operation • High-Frequency Operation (up to 1.5 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • L

文件:827.08 Kbytes 页数:25 Pages

TI

德州仪器

CSD87333Q3DG4

丝印:87333D;Package:VSON-CLIP(DPB);CSD87333Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Optimized for High-Duty Cycle • Up to 24 Vin • 94.7% System Efficiency at 8 A • 1.5 W PLoss at 8 A • Up to 15-A Operation • High-Frequency Operation (up to 1.5 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • L

文件:827.08 Kbytes 页数:25 Pages

TI

德州仪器

CSD87333Q3DG4.B

丝印:87333D;Package:VSON-CLIP(DPB);CSD87333Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Optimized for High-Duty Cycle • Up to 24 Vin • 94.7% System Efficiency at 8 A • 1.5 W PLoss at 8 A • Up to 15-A Operation • High-Frequency Operation (up to 1.5 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • L

文件:827.08 Kbytes 页数:25 Pages

TI

德州仪器

CSD87333Q3DG4.B

丝印:87333D;Package:VSON-CLIP;CSD87333Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Optimized for High-Duty Cycle • Up to 24 Vin • 94.7% System Efficiency at 8 A • 1.5 W PLoss at 8 A • Up to 15-A Operation • High-Frequency Operation (up to 1.5 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • L

文件:823.57 Kbytes 页数:24 Pages

TI

德州仪器

CSD87333Q3DT

丝印:87333D;Package:VSON-CLIP;CSD87333Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Optimized for High-Duty Cycle • Up to 24 Vin • 94.7% System Efficiency at 8 A • 1.5 W PLoss at 8 A • Up to 15-A Operation • High-Frequency Operation (up to 1.5 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • L

文件:823.57 Kbytes 页数:24 Pages

TI

德州仪器

CSD87333Q3DT

丝印:87333D;Package:VSON-CLIP(DPB);CSD87333Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Optimized for High-Duty Cycle • Up to 24 Vin • 94.7% System Efficiency at 8 A • 1.5 W PLoss at 8 A • Up to 15-A Operation • High-Frequency Operation (up to 1.5 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • L

文件:827.08 Kbytes 页数:25 Pages

TI

德州仪器

CSD87333Q3DT.B

丝印:87333D;Package:VSON-CLIP(DPB);CSD87333Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Optimized for High-Duty Cycle • Up to 24 Vin • 94.7% System Efficiency at 8 A • 1.5 W PLoss at 8 A • Up to 15-A Operation • High-Frequency Operation (up to 1.5 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • L

文件:827.08 Kbytes 页数:25 Pages

TI

德州仪器

产品属性

  • 产品编号:

    8733

  • 制造商:

    Keystone Electronics

  • 类别:

    五金件,紧固件,配件 > 板垫片,支座

  • 包装:

    散装

  • 类型:

    六角支座

  • 有螺纹/无螺纹:

    有螺纹

  • 公母:

    公头,母头

  • 螺钉、螺纹规格:

    #8-32

  • 直径 - 外部:

    0.250"(6.35mm)1/4" 六角形

  • 板间高度:

    0.250"(6.35mm)1/4"

  • 长度 - 总体:

    0.625"(15.88mm)5/8"

  • 材料:

  • 镀层:

  • 描述:

    HEX STANDOFF #8-32 ALUMINUM 1/4\

供应商型号品牌批号封装库存备注价格
Keystone Electronics
2022+
1
全新原装 货期两周
询价
AWINIC
25+
QFN20
15000
全新原装现货,价格优势
询价
MOLEX
24+/25+
4400
原装正品现货库存价优
询价
N/A
24+
DIP40
25843
公司原厂原装现货假一罚十!特价出售!强势库存!
询价
MOL
23+
NA
380
专做原装正品,假一罚百!
询价
IDT, Integrated Device Technol
24+
8-SOIC
56200
一级代理/放心采购
询价
IDT
1931+
N/A
1186
加我qq或微信,了解更多详细信息,体验一站式购物
询价
MOL
2447
CONN
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
询价
IDT
25+
SOP-8
1001
就找我吧!--邀您体验愉快问购元件!
询价
IDT
19+
TSSOP20
8900
原盘原盒 进口原装!假一罚十!特价!
询价
更多8733供应商 更新时间2026-4-20 9:51:00