丝印：87330D；Package：VSON-CLIP(DPB)；CSD87330Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Up to 27-V VIN • 90% System Efficiency at 15 A • Up to 20-A Operation • High-Frequency Operation (Up to 1.5 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low Inductance Package •

文件：637.9 Kbytes 页数：24 Pages

TI

德州仪器

丝印：87330D；Package：VSON-CLIP(DPB)；CSD87330Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Up to 27-V VIN • 90% System Efficiency at 15 A • Up to 20-A Operation • High-Frequency Operation (Up to 1.5 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low Inductance Package •

文件：637.9 Kbytes 页数：24 Pages

TI

德州仪器

丝印：87330D；Package：VSON-CLIP；CSD87330Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Up to 27-V VIN • 90% System Efficiency at 15 A • Up to 20-A Operation • High-Frequency Operation (Up to 1.5 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low Inductance Package •

文件：637.48 Kbytes 页数：24 Pages

TI

德州仪器

丝印：87331D；Package：LSON-CLIP；CSD87331Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Up to 27-V VIN • Up to 15-A Operation • 91% System Efficiency at 10 A • High-Frequency Operation (up to 1.5 MHz) • High Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low-Inductance Package •

文件：885.29 Kbytes 页数：27 Pages

TI

德州仪器

丝印：87331D；Package：LSON-CLIP(DQZ)；CSD87331Q3D Synchronous Buck NexFET™ Power Block

1 Features • Half-Bridge Power Block • Up to 27-V VIN • Up to 15-A Operation • 91% System Efficiency at 10 A • High-Frequency Operation (up to 1.5 MHz) • High Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low-Inductance Package •

文件：885.71 Kbytes 页数：27 Pages

TI

德州仪器

丝印：87331D；Package：LSON-CLIP(DQZ)；CSD87331Q3D Synchronous Buck NexFET™ Power Block

1 Features • Half-Bridge Power Block • Up to 27-V VIN • Up to 15-A Operation • 91% System Efficiency at 10 A • High-Frequency Operation (up to 1.5 MHz) • High Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low-Inductance Package •

文件：885.71 Kbytes 页数：27 Pages

TI

德州仪器

丝印：87331D；Package：LSON-CLIP；CSD87331Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Up to 27-V VIN • Up to 15-A Operation • 91% System Efficiency at 10 A • High-Frequency Operation (up to 1.5 MHz) • High Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low-Inductance Package •

文件：885.29 Kbytes 页数：27 Pages

TI

德州仪器

丝印：87331D；Package：LSON-CLIP(DQZ)；CSD87331Q3D Synchronous Buck NexFET™ Power Block

1 Features • Half-Bridge Power Block • Up to 27-V VIN • Up to 15-A Operation • 91% System Efficiency at 10 A • High-Frequency Operation (up to 1.5 MHz) • High Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low-Inductance Package •

文件：885.71 Kbytes 页数：27 Pages

TI

德州仪器

丝印：87331D；Package：LSON-CLIP(DQZ)；CSD87331Q3D Synchronous Buck NexFET™ Power Block

1 Features • Half-Bridge Power Block • Up to 27-V VIN • Up to 15-A Operation • 91% System Efficiency at 10 A • High-Frequency Operation (up to 1.5 MHz) • High Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low-Inductance Package •

文件：885.71 Kbytes 页数：27 Pages

TI

德州仪器

丝印：87331D；Package：LSON-CLIP；CSD87331Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Up to 27-V VIN • Up to 15-A Operation • 91% System Efficiency at 10 A • High-Frequency Operation (up to 1.5 MHz) • High Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low-Inductance Package •

文件：885.29 Kbytes 页数：27 Pages

TI

德州仪器