Heyco-Flex™ Quick Twist Conduit Fittings

文件：136.68 Kbytes 页数：1 Pages

HEYCO

包装：散装 类别：风扇，热管理 风扇 - 护手板，滤波器和套管 描述：FAN GUARD 92MM

Keystone Electronics

包装：袋 类别：五金件，紧固件，配件 旋钮 描述：CT.476-P, WING KNOBS, ZINC-PLATE

Elesa USA Corporation

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：643.42 Kbytes 页数：32 Pages

MACOM

ASSY, 1.00MM FFC CONN SMT, H

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：64.879 Kbytes 页数：1 Pages

MACOM

ASSY, 1.00MM FFC CONN SMT, H

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：64.879 Kbytes 页数：1 Pages

MACOM

ASSY, 1.00MM FFC CONN SMT, H

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：64.879 Kbytes 页数：1 Pages

MACOM

ASSY, 1.00MM FFC CONN SMT, H

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：64.879 Kbytes 页数：1 Pages

MACOM

ASSY, 1.00MM FFC CONN SMT, H

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：64.879 Kbytes 页数：1 Pages

MACOM

ASSY, 1.00MM FFC CONN SMT, H

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：64.879 Kbytes 页数：1 Pages

MACOM