HOLE PLUGS & BUSHINGS

文件：313.08 Kbytes 页数：1 Pages

KEYSTONE

Keystone Electronics Corp.

GROMMETS, BUMPERS & BUSHINGS

文件：83.93 Kbytes 页数：1 Pages

KEYSTONE

Keystone Electronics Corp.

CHOKE Differential Mode Suppression Chokes

文件：103.4 Kbytes 页数：1 Pages

FILTRAN

费尔兰特

Heyco-Flex™ Quick Twist Conduit Fittings

文件：136.68 Kbytes 页数：1 Pages

HEYCO

包装：散装 类别：电缆，电线 - 管理 衬套，索环 描述：BUSHING SPLIT 0.671\

Keystone Electronics

1.0 mm, FPC Connector, Right Angle, SMT, Bottom Contact

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：52.6 Kbytes 页数：2 Pages

MACOM

1.0 mm, FPC Connector, Right Angle, SMT, Bottom Contact

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：52.6 Kbytes 页数：2 Pages

MACOM

1.0 mm, FPC Connector, Right Angle, SMT, Bottom Contact

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：52.6 Kbytes 页数：2 Pages

MACOM

1.0 mm, FPC Connector, Right Angle, SMT, Bottom Contact

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：52.6 Kbytes 页数：2 Pages

MACOM

1.0 mm, FPC Connector, Right Angle, SMT, Bottom Contact

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：52.6 Kbytes 页数：2 Pages

MACOM