ATX Motherboard with LGA1700 Socket 14th/13th/12th Gen Intel® Core™ i9/i7/i5/i3, Pentium® or Celeron® Processor, Intel® Q670E, USB 3.2 Gen1x1, SATA 3.0, GbE and 2.5GbE LAN, VGA, DVI-D, and HDMI

Features ● LGA1700 socket 14th/13th/12th gen Intel® Core™ i9/i7/i5/i3, Pentium® or Celeron® processor ● Four 288-pin DDR4-3200 non-ECC Long-DIMM, up to 128GB ● Supports triple-view with VGA, DVI-D, and HDMI interfaces ● Supports M.2 Key M 2280 and Key E 2230 ● 6 USB 3.2 Gen1x1 and 2 USB 3.2 G

文件：416.01 Kbytes 页数：2 Pages

AXIOMTEK

艾讯科技

Micro ATX Motherboard with LGA1700 Socket 14th/13th/12th Gen Intel® Core™ Processor, Intel® H610, USB 3.2 Gen1x1 , SATA 3.0, Dual GbE, 2.5GbE, VGA, DP and DVI-D

Features ● LGA1700 socket 14th/13th/12th gen Intel® Core™ i9/i7/i5/i3, Pentium® or Celeron® processor ● Dual 288-pin DDR4-3200 Long-DIMM, up to 64GB ● Supports triple-view display via DisplayPort, VGA, and DVI-D ● Supports M.2 Key M 2280/2242 ● Supports USB 3.2 Gen1x1 and USB 2.0

文件：507.82 Kbytes 页数：2 Pages

AXIOMTEK

艾讯科技

COM Express Type 6 Compact Module with 13th/12th Gen Intel® Core™ or Celeron® Processor

Features ● 13th/12th gen Intel® Core™ i7/i5/i3 or Celeron® processor (Raptor Lake U/Alder Lake U) ● Dual channel DDR4-3200 SO-DIMM for up to 64GB memory ● Up to 12 lanes of PCI Express ● 2 SATA Gen3 ● 4 USB 3.2 and 8 USB 2.0 ● Supports NVMe for up to 512GB ● Supports TPM 2.0

文件：460.65 Kbytes 页数：3 Pages

AXIOMTEK

艾讯科技

COM Express Type 6 Compact Module with 13th/12th Gen Intel® Core™ or Celeron® Processor

Features ● 13th/12th gen Intel® Core™ i7/i5/i3 or Celeron® processor (Raptor Lake U/Alder Lake U) ● Dual channel DDR4-3200 SO-DIMM for up to 64GB memory ● Up to 12 lanes of PCI Express ● 2 SATA Gen3 ● 4 USB 3.2 and 8 USB 2.0 ● Supports NVMe for up to 512GB ● Supports TPM 2.0

文件：460.65 Kbytes 页数：3 Pages

AXIOMTEK

艾讯科技

PICMG 1.3 Full-Size CPU Card with LGA1700 14th/13th/12th Gen Intel® Core™ i7/i5/i3, Pentium® or Celeron® Processor, Intel® R680E/H610E, SATA 3.0, M.2 Key E/M, USB 3.2 Gen1/Gen2, Dual 2.5GbE LAN, and DVI-I

Features ● LGA1700 14th/13th/12th gen Intel® Core™ i7/i5/i3, Pentium® or Celeron® processor (up to 125W) ● Intel® R680E/H610E chipset ● DDR5-4400 ECC (for R680E)/non-ECC U-DIMM, up to 192GB ● Supports Intel® AMT and vPro (R680E) ● Supports TPM 2.0 (optional) ● Supports dual 2.5GbE LAN ● Sup

文件：260.649 Kbytes 页数：3 Pages

AXIOMTEK

艾讯科技

N-Channel 30-V (D-S) MOSFET

FEATURES ● TrenchFET® Power MOSFET ● 100 Rg Tested

文件：61.46 Kbytes 页数：4 Pages

VISHAYVishay Siliconix

威世威世科技公司

Common Mode EMI Chokes

Special Features • Dual winding • Low radiation • High current capacity • High inductance • Dielectric strength 1000Vrms • Mounted on VW-1 rated header • Fixed pins for easy PCB insertion • Operating temperature -55 to +105°C

文件：55.4 Kbytes 页数：1 Pages

BOURNS

伯恩斯

Common Mode EMI Chokes

Special Features • Reduce conductive EMI emission • High current capacity • High impedance at low frequency • Dielectric strength 3750 Vrms • Coil wound on UL 94V-0 rated plastic cased ferrite core • Operating temperature -55 to +105 °C

文件：75.72 Kbytes 页数：1 Pages

BOURNS

伯恩斯

Common Mode EMI Chokes

Special Features • Reduce conductive EMI emission • High current capacity • High impedance at low frequency • Dielectric strength 3750 Vrms • Coil wound on UL 94V-0 rated plastic cased ferrite core • Operating temperature -55 to +105 °C

文件：89.94 Kbytes 页数：1 Pages

BOURNS

伯恩斯

MachFlex™, 21G C #18 Str BC, PVC-NYL Ins, TPE Jkt, 1000V WTTC, 600V TC-ER

Product Description MachFlex™ for High Flex, 2+1G Conductor 18AWG (105x38) Bare Copper, PVC-NYL Insulation, TPE Outer Jacket, 1000V WTTC, 600V TC-ER

文件：146.14 Kbytes 页数：2 Pages

BELDEN

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