丝印：4S204BIL；Package：TSSOP；Low Skew, Dual, Programmable 1-to-2 Differential-to-LVDS, LVPECL Fanout Buffer

文件：1.42533 Mbytes 页数：23 Pages

IDT

丝印：4S204BIL；Package：TSSOP；Low Skew, Dual, Programmable 1-to-2 Differential-to-LVDS, LVPECL Fanout Buffer

文件：1.42533 Mbytes 页数：23 Pages

IDT

eMOV Series Varistors

The Encapsulated MOV (eMOV) Series is ideal for SMT processing and Pick and Place assembly. Its low\u0002profile package offers space savings compared to leaded devices. These encapsulated components can withstand higher surge energies (up to 1200A) than MLVs. They are available in standard EIA size

Maida

eMOV Series Varistors

The Encapsulated MOV (eMOV) Series is ideal for SMT processing and Pick and Place assembly. Its low\u0002profile package offers space savings compared to leaded devices. These encapsulated components can withstand higher surge energies (up to 1200A) than MLVs. They are available in standard EIA size

Maida

eMOV Series Varistors

The Encapsulated MOV (eMOV) Series is ideal for SMT processing and Pick and Place assembly. Its low\u0002profile package offers space savings compared to leaded devices. These encapsulated components can withstand higher surge energies (up to 1200A) than MLVs. They are available in standard EIA size

Maida