WS-DITV Small Compact THT Dip Switch

General Information: Operating Temperature -40 up to +85 °C Storage Conditions (in original packaging)

文件：394.25 Kbytes 页数：6 Pages

WURTHWurth Elektronik GmbH & Co. KG, Germany.

伍尔特伍尔特集团

WS-DITV Small Compact THT Dip Switch

General Information: Operating Temperature -40 up to +85 °C Storage Conditions (in original packaging)

文件：393.89 Kbytes 页数：6 Pages

WURTHWurth Elektronik GmbH & Co. KG, Germany.

伍尔特伍尔特集团

WS-DITV Small Compact THT Dip Switch

General Information: Operating Temperature -40 up to +85 °C Storage Conditions (in original packaging)

文件：393.88 Kbytes 页数：6 Pages

WURTHWurth Elektronik GmbH & Co. KG, Germany.

伍尔特伍尔特集团

WS-DITV Small Compact THT Dip Switch

General Information: Operating Temperature -40 up to +85 °C Storage Conditions (in original packaging)

文件：394.22 Kbytes 页数：6 Pages

WURTHWurth Elektronik GmbH & Co. KG, Germany.

伍尔特伍尔特集团

KK® 396 Reflow Process Compatible (RPC) Compatible (RPC)

Features and Benefits High-temperature nylon housing Withstands lead-free hightemperature solder processing up to +260°C. Does not require the drying needs of normal nylon Optional MarKK terminal with four points of contact Supports up to 13.0A per circuit. Ideal for higher power and highv

文件：806.17 Kbytes 页数：2 Pages

MOLEX

莫仕

PCB Headers and Receptacles

Product Description : 3.96mm Pitch, KK 396 RPC Wire-to-Board Right-Angle Header with Friction Lock, Tin (Sn) Plating, Bag, 2 Circuits

文件：115.38 Kbytes 页数：4 Pages

MOLEX

莫仕

DC axial compact fan

Technical description Impeller material Glass-fiber reinforced PA plastic Weight 0.390 kg Dimensions 119 x 119 x 38 mm Housing material Die-cast aluminum Airflow direction Intake ove

文件：131.54 Kbytes 页数：4 Pages

EBMPAPST

依必安派特

DC axial compact fan

Technical description Impeller material Glass-fiber reinforced PA plastic Weight 0.390 kg Dimensions 119 x 119 x 38 mm Housing material Die-cast aluminum Airflow direction

文件：131.31 Kbytes 页数：4 Pages

EBMPAPST

依必安派特

DC axial compact fan

Technical description Impeller material Glass-fiber reinforced PA plastic Weight 0.390 kg Dimensions 119 x 119 x 38 mm Housing material

文件：131.92 Kbytes 页数：4 Pages

EBMPAPST

依必安派特

ECP5 Versa Development Board User Guide

Features • Half-length PCI Express form-factor —Allows demonstration of PCI Express x1 interconnection • Electrical testing of one full-duplex SERDES channel via SMA connections • USB-B connection for UART and device programming • Two RJ45 interfaces to 10/100/1000 Ethernet to RGMII • On-bo

文件：3.25954 Mbytes 页数：32 Pages

LATTICE

莱迪思