Surface Mount NPN General Purpose Transistor

Features: ·Ceramic 3 pun surface mount package (UBN) ·Miniature package to minimize circuit board area ·Hermetically sealed ·Processes per MIL-PRF-19500/255 ·Same footprint and pin-out as many SOT-23 package transistors

文件：1.00969 Mbytes 页数：3 Pages

TTELEC

NPN SILICON SWITCHING TRANSISTOR Qualified per MIL-PRF-19500/255

NPN SILICON SWITCHING TRANSISTOR Qualified per MIL-PRF-19500/255

文件：142.92 Kbytes 页数：6 Pages

MICROSEMI

美高森美

Surface Mount NPN General Purpose Transistor

Features: ·Ceramic 3 pun surface mount package (UBN) ·Miniature package to minimize circuit board area ·Hermetically sealed ·Processes per MIL-PRF-19500/255 ·Same footprint and pin-out as many SOT-23 package transistors

文件：1.00969 Mbytes 页数：3 Pages

TTELEC

Surface Mount NPN General Purpose Transistor

Features: ·Ceramic 3 pun surface mount package (UBN) ·Miniature package to minimize circuit board area ·Hermetically sealed ·Processes per MIL-PRF-19500/255 ·Same footprint and pin-out as many SOT-23 package transistors

文件：1.00969 Mbytes 页数：3 Pages

TTELEC

Silicon NPN Transistor

文件：234.31 Kbytes 页数：2 Pages

SEMICOA

NPN SILICON SWITCHING TRANSISTOR

文件：142.92 Kbytes 页数：6 Pages

MICROSEMI

美高森美

RADIATION HARDENED

文件：144.21 Kbytes 页数：7 Pages

MICROSEMI

美高森美

TECHNICAL DATA SHEET NPN SILICON SWITCHING TRANSISTOR

文件：142.92 Kbytes 页数：6 Pages

MICROSEMI

美高森美

NPN Silicon Switching 50V, 0.8A

This specification covers the performance requirements for NPN, silicon, switching 2N2221 and 2N2222 transistors. Four levels of product assurance (JAN, JANTX, JANTXV and JANS) are provided for each encapsulated device type as specified in MIL-PRF-19500/255 and two levels of product assurance (JANHC The device packages for the encapsulated device types are as follows: 2N2221A and 2N2222A (TO-18, UA, UB, UBC, UBN, and UBCN). \nThe dimensions and topography for JANHC and JANKC unencapsulated die are as outlined in MIL-PRF-19500/255.;

Microchip

微芯科技

Transistor NPN 50V 0.8A

TT Electronics