64K(8K x 8) UV ERASABLE PROMs

文件：1.37774 Mbytes 页数：10 Pages

INTEL

英特尔

IBS EINBC METER - Hybrid cable

INTERBUS hybrid cable for the extended installation remote bus

文件：198.01 Kbytes 页数：5 Pages

PHOENIXPHOENIX CONTACT

菲尼克斯德国菲尼克斯电气集团

LOW DROPOUT MICROPOWER VOLTAGE REGULATOR

The MC33275 series are micropower low dropout voltage regulators available in a wide variety of output voltages as well as packages, SOT−223, SOP−8, DPAK, and DFN 4x4 surface mount packages. These devices feature a very low quiescent current and are capable of supplying output currents up to 300 m

文件：197.44 Kbytes 页数：12 Pages

ONSEMI

安森美半导体

Plug-in board - IBS UNI DIO

Universal I/O module in the form of a daughterboard

文件：186.98 Kbytes 页数：5 Pages

PHOENIXPHOENIX CONTACT

菲尼克斯德国菲尼克斯电气集团

FEED-THROUGH TERMINAL BLOCK, SNA

To feed through power, signal, and data is the classical requirement in electrical engineering and panel building. The insulating material, the connection system and the design of the terminal blocks are the differentiating features. A feed-through terminal block is suitable for joining and/o

文件：384.57 Kbytes 页数：21 Pages

WEIDMULLER

魏德米勒

FEED-THROUGH TERMINAL BLOCK, SNA

To feed through power, signal, and data is the classical requirement in electrical engineering and panel building. The insulating material, the connection system and the design of the terminal blocks are the differentiating features. A feed-through terminal block is suitable for joining and/o

文件：386.44 Kbytes 页数：21 Pages

WEIDMULLER

魏德米勒

FEED-THROUGH TERMINAL BLOCK, SNA

To feed through power, signal, and data is the classical requirement in electrical engineering and panel building. The insulating material, the connection system and the design of the terminal blocks are the differentiating features. A feed-through terminal block is suitable for joining and/o

文件：388.06 Kbytes 页数：21 Pages

WEIDMULLER

魏德米勒

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

文件：8.04467 Mbytes 页数：21 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

文件：8.04467 Mbytes 页数：21 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

文件：8.04467 Mbytes 页数：21 Pages

ETCList of Unclassifed Manufacturers

未分类制造商