Direct replacement for T1 쩐 Midget Flange SX6s

文件：195.52 Kbytes 页数：4 Pages

MARL

丝印：236；Package：TFDSO-16；LITIX™ Basic

Features • Three-channel device with integrated and protected output stages (current sinks), optimized to drive LEDs • High output current up to 150 mA per channel • Independent output current control via enable pins • Fault management supports both 1-fail-all-OFF and 1-fail-all-ON • Analog

文件：655.37 Kbytes 页数：32 Pages

Infineon

英飞凌

丝印：236；300 mA, 28 V low-dropout voltage regulator, with 5 關A quiescent current

文件：721.63 Kbytes 页数：21 Pages

STMICROELECTRONICS

意法半导体

包装：剪切带（CT）Digi-Reel® 得捷定制卷带 类别：连接器，互连器件 音频连接器 描述：CONN PLUG STEREO 6.35MM RA 3COND

Switchcraft Inc.

包装：袋 类别：电池产品 电池座，电池夹，电池触头 描述：BATT CONN SNAP 9V 1 CEL 6\

Keystone Electronics

Low voltage fast-switching PNP power transistors

Description The devices are PNP transistors manufactured using new “PB-HDC” (power bipolar high density current) technology. The resulting transistor shows exceptional high gain performances coupled with very low saturation voltage. The complementary NPN types are the 2STD1360T4, the 2STF1360 an

文件：187.89 Kbytes 页数：9 Pages

STMICROELECTRONICS

意法半导体

WE-D-SUB Filter Adapter

General Information: Operating Temperature -55 up to +125 °C Storage Conditions (in original packaging)

文件：301.93 Kbytes 页数：5 Pages

WURTHWurth Elektronik GmbH & Co. KG, Germany.

伍尔特伍尔特集团

SWITCH-MODE TRANSFORMER GUIDE

CONSUMER PRODUCTS Pulse offers a complete range of Switch-Mode Transformers in various technologies (slot, layer and triple insulation wire) used for power supplies in television, set-top boxes, satellite receivers, DVD players, telephone chargers, and white goods. Pulse also offers a new range o

文件：193.39 Kbytes 页数：5 Pages

pulse

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

文件：8.04467 Mbytes 页数：21 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

文件：8.04467 Mbytes 页数：21 Pages

ETCList of Unclassifed Manufacturers

未分类制造商