丝印：1N4001G；Package：DO-204AL；1A, 50V - 1000V Standard Rectifier

文件：391.27 Kbytes 页数：5 Pages

TSC

台湾半导体

丝印：M1；Package：DO-214AC；Surface Mount General Purpose Silicon Rectifiers

Features For surface mounted applications Low profile package Glass passivated chip junction Easy to pick and place Lead free in comply with EU RoHS 2011/65/EU directives

文件：2.22862 Mbytes 页数：4 Pages

UNSEMI

优恩半导体

丝印：MDD1N4001G；Package：DO-41；GLASS PASSIVATED SILICON RECTIFIER

文件：735.18 Kbytes 页数：2 Pages

CHENDA

辰达半导体

丝印：MDD1N4001G；Package：A-405；GLASS PASSIVATED GENERAL PURPOSE RECTIFIER

文件：667.15 Kbytes 页数：2 Pages

CHENDA

辰达半导体

丝印：M1；Package：SMA；Surface Mount General Purpose Silicon Rectifiers Reverse Voltage - 50 to 1000 V Forward Current - 1 A

文件：1.41946 Mbytes 页数：3 Pages

SKTECHNOLGYSHIKE Electronics

时科广东时科微实业有限公司

A GENERAL PURPOSE GLASS PASSIVATED RECTIFIER

FEATURES ● UL 94V0 FLAME RETARDANT EPOXY MOLDING COMPOUND ● GLASS PASSIVATED CHIP JUNCTION ● LOW COST ● HIGH SURGE CURRENT CAPABILITY

文件：121.76 Kbytes 页数：2 Pages

FRONTIER

Frontier Electronics

GLASS PASSIVATED GENERAL PURPOSE RECTIFIERS

FEATURES : * Glass passivated chip * High current capability * High reliability * Low reverse current * Low forward voltage drop

文件：1.09853 Mbytes 页数：2 Pages

TAYCHIPSTShenzhen Taychipst Electronic Co., Ltd

泰迪斯电子深圳市泰迪斯电子科技有限公司

General Purpose Rectifier

Features ● High efficiency ● High current capability ● High reliability ● High surge current capability ● Low power loss ● Glass passivated chip junction ● Solder dip 275 °C max. 7 s, per JESD 22-B106

文件：207.9 Kbytes 页数：4 Pages

YANGJIE

扬杰电子

GLASS PASSIVATED SILICON RECTIFIER

Reverse Voltage - 50 to 1000 Volts Forward Current - 1.0 Ampere FEATURES ◆ The plastic package carries Underwriters Laboratory Flammability Classification 94V-0 ◆ Construction utilizes void-free molded plastic technique ◆ Low reverse leakage ◆ High forward surge current capability ◆

文件：584.41 Kbytes 页数：2 Pages

CHENDA

辰达半导体

Plastic Silicon Rectifier

Features ● High efficiency ● High current capability ● High reliability ● High surge current capability ● Low power loss ● Glass passivated chip junction ● Solder dip 275 °C max. 7 s, per JESD 22-B106

文件：1.28277 Mbytes 页数：3 Pages

SAMYANG

三阳电子