LGA 4189 Intel® Xeon® Scalable Proprietary Server Board with 16x DDR4, 4 x PCIe x16, 10 x SATA3, 8 x USB 3.2 (Gen 1), Dual 10GbE, and IPMI

Features ƒ LGA4189 proprietary server board with 3rd Gen Intel® Xeon® scalable processor ƒ DDR4 3200 MHz RDIMM up to 2TB supports Intel® Optane™ Persistent Memory ƒ 4 x PCIe x16 and 7 x PCIe x8 ƒ Intel® X550 dual 10GbE ports ƒ Ten SATA3 and two M.2 connectors (SATA/PCIe compatible) ƒ 0 ~ 4

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2U 20” short-depth Edge Accelerator Server with Dual Intel® 3rd Gen Xeon® Scalable processors, supporting 8 expansion slots

Features ƒ Dual Intel® 3rd Gen Xeon® Scalable processors ƒ DDR4 3200MHz RDIMM up to 1TB, support Intel Optane Persistent Memory ƒ Four PCIe x16 slots support FH/10.5L Cards* ƒ Four PCIeX8 slots support HH/HL Cards ƒ Four 2.5 hot-swappable SASII/SATAIII drive bays (Two can be NVMe in option)

文件：1.82841 Mbytes 页数：2 Pages

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MXM 3.1 Type A NVIDIA® Quadro® Embedded T1000 with DP 1.4a

Features ƒ NVIDIA® Quadro® T1000 with MXM 3.1 TYPE A form factor(82 x 70 mm) ƒ Up to 896 CUDA cores , 2.6 TFLOPS ƒ GDDR6 4GB memory, 128-bit, bandwidth 192 GB/s ƒ Up to 4 x DisplayPort 1.4a outputs ƒ Long life cycle, supports 5 years availability

文件：443.34 Kbytes 页数：2 Pages

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Water-resistant Fanless In-vehicle AI Computer with Intel® 8th/9th Gen Core™ i CPU

Features ƒ Intel® 8th/9th Gen Core™ i socket-type CPU (LGA1151) with H310 PCH ƒ 8GB memory on board and 1 x DDR4 SO-DIMM socket ƒ Support MXM type GPU module ƒ Supports 2 x Gigabit Ethernet, 2 x USB3.0/3.1 ƒ Supports 2 x COM (RS232/422/485) ƒ Supports 1 x mSATA, 2 x 2.5 HDD/SSD ƒ Supports 3

文件：569.26 Kbytes 页数：2 Pages

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11th Gen. Intel® Core™ i7/i5/i3/Celeron U-series Pico-ITX SBC

Features ƒ 11th Gen. Intel® Core™ Processor with Quad/Dual Cores, TDP 15W ƒ On-board LPDDR4x-4267 up to 32G with IBECC for Industrial Sku ƒ Dual independent display: eDP/MIPI-DSI, DP up to 8K ƒ 2 GbE, 2 USB 3.2, COM Port, SMBus/I2C ƒ Expansion: M.2 E-Key, M.2 B-Key/M-Key NVMe x2 ƒ Supports i

文件：5.47592 Mbytes 页数：6 Pages

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11th Gen. Intel® Core™ i7/i5/i3/Celeron U-series Pico-ITX SBC

Features ƒ 11th Gen. Intel® Core™ Processor with Quad/Dual Cores, TDP 15W ƒ On-board LPDDR4x-4267 up to 32G with IBECC for Industrial Sku ƒ Dual independent display: eDP/MIPI-DSI, DP up to 8K ƒ 2 GbE, 2 USB 3.2, COM Port, SMBus/I2C ƒ Expansion: M.2 E-Key, M.2 B-Key/M-Key NVMe x2 ƒ Supports i

文件：5.47592 Mbytes 页数：6 Pages

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Intel Atom x6000, Pentium and Celeron® x6000 Series Processor (Code Name: Elkhart Lake) SMARC Module

Features ƒ Intel Atom® x6000, Pentium® and Celeron® x6000 Series processor ƒ SMARC2.1.1 pinout, small size ƒ Dual-CH LPDDR4 3200MT/s up to 16GB, support IBECC ƒ Triple displays up to 4K2K (DP++, HDMI, LVDS/eDP/MIPI-DSI) ƒ Multiple I/O expansion: PCIe gen3, USB3.2 Gen2, USB2.0, SATA ƒ On boar

文件：5.9148 Mbytes 页数：7 Pages

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Intel Atom x6000, Pentium and Celeron® x6000 Series Processor (Code Name: Elkhart Lake) SMARC Module

Features ƒ Intel Atom® x6000, Pentium® and Celeron® x6000 Series processor ƒ SMARC2.1.1 pinout, small size ƒ Dual-CH LPDDR4 3200MT/s up to 16GB, support IBECC ƒ Triple displays up to 4K2K (DP++, HDMI, LVDS/eDP/MIPI-DSI) ƒ Multiple I/O expansion: PCIe gen3, USB3.2 Gen2, USB2.0, SATA ƒ On boar

文件：5.9148 Mbytes 页数：7 Pages

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AMD Embedded Ryzen V2000 COM Express® Compact Type 6

Features ƒ AMD Embedded Ryzen 7nm SoC – V2000 APU ƒ COM Express® R3.0 Compact Module Type 6 Pinout ƒ Dual Channel DDR4 SODIMM, max. 64GB (Both ECC & Non-ECC) ƒ High Speed I/Os: 2 USB 3.2 Gen2, 1 PCIe x8 Gen3, 8 PCIe x1 Gen3, and 2 SATA3.0 ƒ Four Display (DP++, HDMI, VGA, LVDS) ƒ Supports iM

文件：4.18813 Mbytes 页数：6 Pages

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AMD Embedded Ryzen V2000 COM Express® Compact Type 6

Features ƒ AMD Embedded Ryzen 7nm SoC – V2000 APU ƒ COM Express® R3.0 Compact Module Type 6 Pinout ƒ Dual Channel DDR4 SODIMM, max. 64GB (Both ECC & Non-ECC) ƒ High Speed I/Os: 2 USB 3.2 Gen2, 1 PCIe x8 Gen3, 8 PCIe x1 Gen3, and 2 SATA3.0 ƒ Four Display (DP++, HDMI, VGA, LVDS) ƒ Supports iM

文件：4.18813 Mbytes 页数：6 Pages

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