1970004906T001

MXM 3.1 Type A NVIDIA® Quadro® Embedded T1000 with DP 1.4a

Features ƒNVIDIA®Quadro®T1000withMXM3.1TYPEAformfactor(82x70mm) ƒUpto896CUDAcores,2.6TFLOPS ƒGDDR64GBmemory,128-bit,bandwidth192GB/s ƒUpto4xDisplayPort1.4aoutputs ƒLonglifecycle,supports5yearsavailability

1970004906T001

Water-resistant Fanless In-vehicle AI Computer with Intel® 8th/9th Gen Core™ i CPU

Features ƒIntel®8th/9thGenCore™isocket-typeCPU(LGA1151)withH310PCH ƒ8GBmemoryonboardand1xDDR4SO-DIMMsocket ƒSupportMXMtypeGPUmodule ƒSupports2xGigabitEthernet,2xUSB3.0/3.1 ƒSupports2xCOM(RS232/422/485) ƒSupports1xmSATA,2x2.5HDD/SSD ƒSupports3

1970004956T001

11th Gen. Intel® Core™ i7/i5/i3/Celeron U-series Pico-ITX SBC

Features ƒ11thGen.Intel®Core™ProcessorwithQuad/DualCores,TDP15W ƒOn-boardLPDDR4x-4267upto32GwithIBECCforIndustrialSku ƒDualindependentdisplay:eDP/MIPI-DSI,DPupto8K ƒ2GbE,2USB3.2,COMPort,SMBus/I2C ƒExpansion:M.2E-Key,M.2B-Key/M-KeyNVMex2 ƒSupportsi

1970004968N001

11th Gen. Intel® Core™ i7/i5/i3/Celeron U-series Pico-ITX SBC

Features ƒ11thGen.Intel®Core™ProcessorwithQuad/DualCores,TDP15W ƒOn-boardLPDDR4x-4267upto32GwithIBECCforIndustrialSku ƒDualindependentdisplay:eDP/MIPI-DSI,DPupto8K ƒ2GbE,2USB3.2,COMPort,SMBus/I2C ƒExpansion:M.2E-Key,M.2B-Key/M-KeyNVMex2 ƒSupportsi

1970005009N001

Intel Atom x6000, Pentium and Celeron® x6000 Series Processor (Code Name: Elkhart Lake) SMARC Module

Features ƒIntelAtom®x6000,Pentium®andCeleron®x6000Seriesprocessor ƒSMARC2.1.1pinout,smallsize ƒDual-CHLPDDR43200MT/supto16GB,supportIBECC ƒTripledisplaysupto4K2K(DP++,HDMI,LVDS/eDP/MIPI-DSI) ƒMultipleI/Oexpansion:PCIegen3,USB3.2Gen2,USB2.0,SATA ƒOnboar

1970005010N001

Intel Atom x6000, Pentium and Celeron® x6000 Series Processor (Code Name: Elkhart Lake) SMARC Module

Features ƒIntelAtom®x6000,Pentium®andCeleron®x6000Seriesprocessor ƒSMARC2.1.1pinout,smallsize ƒDual-CHLPDDR43200MT/supto16GB,supportIBECC ƒTripledisplaysupto4K2K(DP++,HDMI,LVDS/eDP/MIPI-DSI) ƒMultipleI/Oexpansion:PCIegen3,USB3.2Gen2,USB2.0,SATA ƒOnboar

1970005033T001

AMD Embedded Ryzen V2000 COM Express® Compact Type 6

Features ƒAMDEmbeddedRyzen7nmSoC–V2000APU ƒCOMExpress®R3.0CompactModuleType6Pinout ƒDualChannelDDR4SODIMM,max.64GB(BothECC&Non-ECC) ƒHighSpeedI/Os:2USB3.2Gen2,1PCIex8Gen3,8PCIex1Gen3,and 2SATA3.0 ƒFourDisplay(DP++,HDMI,VGA,LVDS) ƒSupportsiM

1970005034T001

AMD Embedded Ryzen V2000 COM Express® Compact Type 6

Features ƒAMDEmbeddedRyzen7nmSoC–V2000APU ƒCOMExpress®R3.0CompactModuleType6Pinout ƒDualChannelDDR4SODIMM,max.64GB(BothECC&Non-ECC) ƒHighSpeedI/Os:2USB3.2Gen2,1PCIex8Gen3,8PCIex1Gen3,and 2SATA3.0 ƒFourDisplay(DP++,HDMI,VGA,LVDS) ƒSupportsiM

1970005036T001

Intel® 11th Gen Core Processors (Code Name: Tiger Lake-H) (Code Name: Tiger Lake-H)

Features ƒIntel®11thGenCoreProcessors,upto8Core/16T,L3Cache24M ƒIntelIrisXe(Gen12)graphics,4independent4Kdisplay ƒDualchannelDDR4Max128GBSODIMM,supportECC ƒSuperspeedI/O:PCIe4x16(16GT/s),USB3.2gen3(10Gb),2.5GbE, SATA3(6Gb) ƒTPM2.0securityprotection,

1970005036T001

Intel® Xeon® D Processor (Code Name: Ice Lake-D LCC) COM Express® Basic Type7

Features ƒIntel®Xeon®DProcessor ƒCOMExpressR3.0BasicModuleType7pinout ƒ4~10coreprocessor,withmax.TDP67W ƒHighspeedEthernet(4x10GBASE-KRinterfaces,oneGbE) ƒVariousexpansion(PCIex16Gen4,PCIeX8,4PCIeX1,4USB3.0,2SATA3) ƒSupportsSUSI,DeviceOnandEdge