Intel® Wireless 6E AX210 (No vPro) M.2 2230 A-E Key module with cables and antennas

Features ƒ IEEE 802.11 ax/ac/a/b/g/n (2.4GHz/5GHz/6GHz) + Bluetooth 5.3 ƒ 2Tx/2Rx ƒ WPA2*, WPA3* ƒ 802.1x EAP-TLS, EAP-TTLS/MSCHAPv2, PEAPv0-MSCHAPv2 (EAP-SIM, EAP-AKA, EAP-AKA') ƒ Supports wide operating temperatures (-40~85°C / -40~185°F) ƒ Supports Windows 10*, Linux*, and Chrome OS* ƒ

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Intel® Wireless 6E AX210 (No vPro) M.2 2230 A-E Key module with cables and antennas

Features ƒ IEEE 802.11 ax/ac/a/b/g/n (2.4GHz/5GHz/6GHz) + Bluetooth 5.3 ƒ 2Tx/2Rx ƒ WPA2*, WPA3* ƒ 802.1x EAP-TLS, EAP-TTLS/MSCHAPv2, PEAPv0-MSCHAPv2 (EAP-SIM,EAP-AKA, EAP-AKA') ƒ Supports wide operating temperatures (0 ~ 70 °C/32 ~ 158 °F) ƒ Supports Windows 10*, Linux*, and Chrome OS* ƒ W

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Intel® Wireless 6E AX210 (Vpro) M.2 2230 A-E Key module with cables and antennas

Features ƒ IEEE 802.11 ax/ac/a/b/g/n (2.4GHz/5GHz/6GHz) + Bluetooth 5.3 ƒ 2Tx/2Rx ƒ WPA2*, WPA3* ƒ 802.1x EAP-TLS, EAP-TTLS/MSCHAPv2, PEAPv0-MSCHAPv2 (EAP-SIM, EAP-AKA, EAP-AKA') ƒ Supports wide operating temperatures (-40 ~ 85 °C/-40 ~ 185 °F) ƒ Supports Windows 10*, Linux*, and Chrome OS*

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802.11ac/a/b/g/n and BT 5.0 M.2 2230 Module

Features ƒ IEEE 802.11ac/a/b/g/n (2.4 and 5GHz) and Bluetooth 5.0 ƒ Supports MU-MIMO (2T2R) ƒ Wide operating temperature -30 ~ 85 °C (-22 ~ 185 °F) ƒ Supports Linux OS ƒ M.2 2230 form factor module (L x W x H) 30 x 22 x 2.85 mm/ 1.18 x .86 x .11 in

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Rockchip Arm Cortex-A55 RK3568 3.5 SBC

Features ƒ Rockchip RK3568 Arm Quad Cortex-A55, up to 2.0GHz ƒ Built-in NPU with processing performance of up to 1.0 TOPS ƒ Onboard 2/4GB LPDDR4 memory and 16/32GB eMMC ƒ Supports 1 x HDMI 2.0 4K, 1 x LVDS/MIPI-DSI, and 1 x eDP ƒ Supports 4K H.264/H.265 video decoder ƒ Provides 2 x GbE, 1 x

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Rockchip ARM Cortex-A72 RK3399 3.5 SBC

Features ƒ Rockchip RK3399 ARM Dual Cortex-A72 and Quad Cortex-A53 1.8 GHz ƒ Onboard 2/4GB LPDDR4 memory and 16/32GB eMMC ƒ Dual HDMI(4K 60fps + 1080P), 1 x eDP, 1 x dual channel LVDS, 1 x MIPI CSI ƒ Supports 4K H.264/H.265 video decoder ƒ 6 x serial, 1 x USB3.0, 4 x USB2.0 ,1 x USB OTG, 2 x

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恩XP i.MX6 Cortex-A9 RISC Embedded Mini-ITX Box Computer

Features ƒ 恩XP ARM Cortex-A9 i.MX6 Dual/Quad 1GHz high performance processor ƒ On board DDR3 1066MHz 1GB/2GB memory and 8GB EMMC NAND flash ƒ Supports Dual Display: VGA/HDMI ƒ Supports 1 x mini-PCIe, 4 x serial ports, 6 x USB, 1 x M.2 socket,8 x GPIO, 1 x CAN ƒ Low power consumption, fanless

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Industrial-Grade Nvidia Jetson Barebone Box PC

Features ƒ NVIDIA Jetson Module compatible Barebone PC ƒ Industrial and Expandable Design ƒ HDMI up to 3840 x 2160 at 60Hz resolution ƒ Dual GbE LAN, 2 USB3.2 Gen 1 ƒ 1 Micro SD Socket & 1 Nano SIM Slot ƒ 1 M.2 3042 Key B Slot, 1 M.2 2230 Key E Slot ƒ 4 Kinds of Rear I/O for Each Vertical F

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恩XP i.MX8M Plus Cortex®-A53 Edge AI RISC-based Box Computer

Features ƒ 恩XP i.MX8M Plus Cortex®-A53 Quad Core 1.6GHz ƒ On-board LPDDR4 6 GB, 4000MT/s memory ƒ HDMI up to 3840 x 2160 at 30Hz resolution ƒ Dual GbE LAN, 1 USB2.0 and 1 USB3.2 Gen 1 ƒ 1 Micro SD Socket & 1 Nano SIM Slot ƒ 1 mini-PCIe for 3G/4G, 1 M.2 2230 Key E Slot ƒ Yocto Linux and Andr

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Intel® Wireless 6E AX210 (Vpro) M.2 2230 A-E Key module with cables and antennas

Features ƒ IEEE 802.11 ax/ac/a/b/g/n (2.4GHz/5GHz/6GHz) + Bluetooth 5.2 ƒ 2Tx/2Rx ƒ WPA2*, WPA3* ƒ 802.1x EAP-TLS, EAP-TTLS/MSCHAPv2, PEAPv0-MSCHAPv2 (EAP-SIM, EAP-AKA, EAP-AKA') ƒ Supports wide operating temperatures (0 ~ 70 °C/32 ~ 158 °F) ƒ Supports Windows 10*, Linux*, and Chrome OS* ƒ

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