丝印：17579；Package：VSONP；CSD17579Q3A 30 V N-Channel NexFET™ Power MOSFETs

1 Features 1• Low Qg and Qgd • Low RDS(on) • Low Thermal Resistance • Avalanche Rated • Pb-Free • RoHS Compliant • Halogen Free • SON 3.3 mm × 3.3 mm Plastic Package 2 Applications • Point-of-Load Synchronous Buck Converter for Applications in Networking, Telecom, and Computing Syste

文件：753.96 Kbytes 页数：12 Pages

TI

德州仪器

丝印：17581；Package：VSONP；CSD17581Q3A 30-V N-Channel NexFET™ Power MOSFETs

1 Features • Low Qg and Qgd • Low RDS(on) • Low Thermal Resistance • Avalanche Rated • Lead-Free • RoHS Compliant • Halogen Free • SON 3.3-mm × 3.3-mm Plastic Package 2 Applications • Point-of-Load Synchronous Buck Converter for Applications in Networking, Telecom, and Computing Syst

文件：577.46 Kbytes 页数：15 Pages

TI

德州仪器

丝印：17581；Package：VSONP；CSD17581Q3A 30-V N-Channel NexFET™ Power MOSFETs

1 Features • Low Qg and Qgd • Low RDS(on) • Low Thermal Resistance • Avalanche Rated • Lead-Free • RoHS Compliant • Halogen Free • SON 3.3-mm × 3.3-mm Plastic Package 2 Applications • Point-of-Load Synchronous Buck Converter for Applications in Networking, Telecom, and Computing Syst

文件：577.46 Kbytes 页数：15 Pages

TI

德州仪器

丝印：17581；Package：VSONP；CSD17581Q3A 30-V N-Channel NexFET™ Power MOSFETs

1 Features • Low Qg and Qgd • Low RDS(on) • Low Thermal Resistance • Avalanche Rated • Lead-Free • RoHS Compliant • Halogen Free • SON 3.3-mm × 3.3-mm Plastic Package 2 Applications • Point-of-Load Synchronous Buck Converter for Applications in Networking, Telecom, and Computing Syst

文件：577.46 Kbytes 页数：15 Pages

TI

德州仪器

丝印：17581；Package：VSONP；CSD17581Q3A 30-V N-Channel NexFET™ Power MOSFETs

1 Features • Low Qg and Qgd • Low RDS(on) • Low Thermal Resistance • Avalanche Rated • Lead-Free • RoHS Compliant • Halogen Free • SON 3.3-mm × 3.3-mm Plastic Package 2 Applications • Point-of-Load Synchronous Buck Converter for Applications in Networking, Telecom, and Computing Syst

文件：577.46 Kbytes 页数：15 Pages

TI

德州仪器

丝印：175N4F6；Package：I2PAK；Automotive-grade N-channel 40 V, 2.1 mΩ typ., 120 A STripFET™ F6 Power MOSFET in an I²PAK package

Features  Designed for automotive applications and AEC-Q101 qualified  Very low on-resistance  Very low gate charge  High avalanche ruggedness  Low gate drive power loss Applications  Switching applications  Power tools Description This device is an N-channel Power MOSFET

文件：654.65 Kbytes 页数：12 Pages

STMICROELECTRONICS

意法半导体

丝印：175Q；Package：VSSOP；TMPx75-Q1 Automotive Grade Temperature Sensor With I2C and SMBus Interface in Industry-Standard LM75 Form Factor and Pinout

1 Features 1• AEC-Q100 Qualified with: – Temperature Grade 1: –40°C to +125°C Ambient Operation Temperature Range – HBM ESD Classification Level 2 – CDM ESD Classification Level C6 • TMP175-Q1 Accuracy: – ±1°C (Typical) from –40°C to +125°C ±2°C (Maximum) from –40°C to +125°C • TMP75-Q1

文件：755.27 Kbytes 页数：33 Pages

TI

德州仪器

丝印：175Q；Package：VSSOP；TMPx75-Q1 Automotive Grade Temperature Sensor With I2C and SMBus Interface in Industry-Standard LM75 Form Factor and Pinout

1 Features 1• AEC-Q100 Qualified with: – Temperature Grade 1: –40°C to +125°C Ambient Operation Temperature Range – HBM ESD Classification Level 2 – CDM ESD Classification Level C6 • TMP175-Q1 Accuracy: – ±1°C (Typical) from –40°C to +125°C analog– ±2°C (Maximum) from –40°C to +125°C • TM

文件：722.76 Kbytes 页数：33 Pages

TI

德州仪器

丝印：175Q；Package：VSSOP；TMPx75-Q1 Automotive Grade Temperature Sensor With I2C and SMBus Interface in Industry-Standard LM75 Form Factor and Pinout

1 Features 1• AEC-Q100 Qualified with: – Temperature Grade 1: –40°C to +125°C Ambient Operation Temperature Range – HBM ESD Classification Level 2 – CDM ESD Classification Level C6 • TMP175-Q1 Accuracy: – ±1°C (Typical) from –40°C to +125°C analog– ±2°C (Maximum) from –40°C to +125°C • TM

文件：722.76 Kbytes 页数：33 Pages

TI

德州仪器

丝印：1759；Buck-Boost Regulator

文件：708.35 Kbytes 页数：8 Pages

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