恩XP ARM® Cortex®-A9 i.MX6 RTX v2.0 module

Features ƒ 恩XP ARM® Cortex®-A9 i.MX6 high performance processor ƒ Onbard DDR3 memory and eMMC 16GB ƒ Supports wide range power input 5V~24V ƒ Supports OpenGL ES 2.0 and OpenVG 1.1 hardware accelerators ƒ Supports full HD 1080p video decode and HD 1080p video encode hardware engine ƒ Support

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Intel® Wireless 6E AX210 (No vPro) M.2 2230 A-E Key module with cables and antennas

Features ƒ IEEE 802.11 ax/ac/a/b/g/n (2.4GHz/5GHz/6GHz) + Bluetooth 5.3 ƒ 2Tx/2Rx ƒ WPA2*, WPA3* ƒ 802.1x EAP-TLS, EAP-TTLS/MSCHAPv2, PEAPv0-MSCHAPv2 (EAP-SIM, EAP-AKA, EAP-AKA') ƒ Supports wide operating temperatures (-40~85°C / -40~185°F) ƒ Supports Windows 10*, Linux*, and Chrome OS* ƒ

文件：397.35 Kbytes 页数：1 Pages

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Intel® Wireless 6E AX210 (No vPro) M.2 2230 A-E Key module with cables and antennas

Features ƒ IEEE 802.11 ax/ac/a/b/g/n (2.4GHz/5GHz/6GHz) + Bluetooth 5.3 ƒ 2Tx/2Rx ƒ WPA2*, WPA3* ƒ 802.1x EAP-TLS, EAP-TTLS/MSCHAPv2, PEAPv0-MSCHAPv2 (EAP-SIM,EAP-AKA, EAP-AKA') ƒ Supports wide operating temperatures (0 ~ 70 °C/32 ~ 158 °F) ƒ Supports Windows 10*, Linux*, and Chrome OS* ƒ W

文件：397.22 Kbytes 页数：1 Pages

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Intel® Wireless 6E AX210 (Vpro) M.2 2230 A-E Key module with cables and antennas

Features ƒ IEEE 802.11 ax/ac/a/b/g/n (2.4GHz/5GHz/6GHz) + Bluetooth 5.3 ƒ 2Tx/2Rx ƒ WPA2*, WPA3* ƒ 802.1x EAP-TLS, EAP-TTLS/MSCHAPv2, PEAPv0-MSCHAPv2 (EAP-SIM, EAP-AKA, EAP-AKA') ƒ Supports wide operating temperatures (-40 ~ 85 °C/-40 ~ 185 °F) ƒ Supports Windows 10*, Linux*, and Chrome OS*

文件：397.22 Kbytes 页数：1 Pages

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802.11ac/a/b/g/n and BT 5.0 M.2 2230 Module

Features ƒ IEEE 802.11ac/a/b/g/n (2.4 and 5GHz) and Bluetooth 5.0 ƒ Supports MU-MIMO (2T2R) ƒ Wide operating temperature -30 ~ 85 °C (-22 ~ 185 °F) ƒ Supports Linux OS ƒ M.2 2230 form factor module (L x W x H) 30 x 22 x 2.85 mm/ 1.18 x .86 x .11 in

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IEEE 802.11ax/ac/a/b/g/n Bluetooth 5.2 M.2 2230 (A-E Key) Card

Features ƒ IEEE 802.11ax/a/b/g/n + Bluetooth 5.2 ƒ Supports 2.4 GHz: 2.412 ~ 2.484 GHz , 5 GHz: 4.915 ~5.925GHz ƒ MU-MIMO, 2Tx/2Rx ƒ Operating temperature: 0~ 70°C (32~158°F)

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IEEE 802.11ax (2.4G/5G) Bluetooth 5.3 LGA Module

Features ƒ IEEE 802.11 ax/ac/a/b/g/n (2.4GHz/5GHz) + Bluetooth 5.3 ƒ 2Tx/2Rx ƒ Wi-Fi: WPA/WPA2/WPA3 ƒ Operating temperature: -40 ~ 85 °C (-40 ~ 185 °F) ƒ Supports Linux ƒ Wi-Fi: Uplink and downlink OFDMA and MU-MIMO ƒ BT: LTE/MWS coexistence

文件：352.73 Kbytes 页数：1 Pages

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IEEE 802.11ax (2.4G/5G) Bluetooth 5.3 M.2 2830 E key Module

Features ƒ IEEE 802.11 ax/ac/a/b/g/n (2.4GHz/5GHz) + Bluetooth 5.3 ƒ 2Tx/2Rx ƒ Wi-Fi: WPA/WPA2/WPA3 ƒ Operating temperature: -40 ~ 85 °C (-40 ~ 185 °F) ƒ Supports Linux ƒ Wi-Fi: Uplink and downlink OFDMA and MU-MIMO ƒ BT: LTE/MWS coexistence

文件：360.7 Kbytes 页数：1 Pages

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恩XP i.MX8M Plus Cortex®-A53 Edge AI RISC-based Box Computer

Features ƒ 恩XP i.MX8M Plus Cortex®-A53 Quad Core 1.6GHz ƒ On-board LPDDR4 6 GB, 4000MT/s memory ƒ HDMI up to 3840 x 2160 at 30Hz resolution ƒ Dual GbE LAN, 1 USB2.0 and 1 USB3.2 Gen 1 ƒ 1 Micro SD Socket & 1 Nano SIM Slot ƒ 1 mini-PCIe for 3G/4G, 1 M.2 2230 Key E Slot ƒ Yocto Linux and Andr

文件：3.13995 Mbytes 页数：4 Pages

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Intel® Wireless 6E AX210 (Vpro) M.2 2230 A-E Key module with cables and antennas

Features ƒ IEEE 802.11 ax/ac/a/b/g/n (2.4GHz/5GHz/6GHz) + Bluetooth 5.2 ƒ 2Tx/2Rx ƒ WPA2*, WPA3* ƒ 802.1x EAP-TLS, EAP-TTLS/MSCHAPv2, PEAPv0-MSCHAPv2 (EAP-SIM, EAP-AKA, EAP-AKA') ƒ Supports wide operating temperatures (0 ~ 70 °C/32 ~ 158 °F) ƒ Supports Windows 10*, Linux*, and Chrome OS* ƒ

文件：392.22 Kbytes 页数：1 Pages

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