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1702002600-01

Intel® Celeron™J1900 Fanless Compact System with 8GB on board

Features ƒ Built-in Intel® Celeron™ J1900 quad-core processor, 2.0 GHz ƒ Fanless, compact system design ƒ 8 GB of DDR3 memory onboard with optional NVRAM ƒ 4 x LAN, 6 x USB, 14 x COM, and 1 x USB 3.0 ports ƒ Replaceable secondary display (VGA 2/DVI-D/LVDS/HDMI) ƒ Supports dual outputs of ful

文件:1.18749 Mbytes 页数:3 Pages

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1702002600-01

8 Industrial-Grade Tablet with Qualcomm® Snapdragon™ 660 Processor, Android 12 with Android Enterprise Recommended

Features ƒ Qualcomm® Snapdragon™ 660 with Android 12 and Android Enterprise Recommended ƒ Certified for Google Mobile Services for downloading apps and APIs ƒ 8 LCD with 400-nit brightness, 1920 x 1200 resolution ƒ Corning® Gorilla® Glass 3 touchscreen supports gloved and stylus operation ƒ

文件:2.13028 Mbytes 页数:7 Pages

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1702002600-02

Compact 1U High Performance Server based on Intel® Xeon® Processor Scalable Family

Features ƒ 1U 20 deep rackmount server ƒ Single Intel® Xeon® Platinum, Gold, Silver or Bronze Processor ƒ 6x DIMM sockets support up to 384 GB DDR4 2933MHz ECC RDIMM/LRDIMM ƒ Rich Add-In Card Support: Up to two FH/FL PCIe x8 Gen3 slots (optional: one FH/FL PCIe x16 Gen3 slot), one LP PCIe x8

文件:674.28 Kbytes 页数:2 Pages

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1702002600-02

Compact 2U Carrier Grade, High Performance Server based on AMD EPYC™ 7003/7002 Series Processors

Features ƒ 2U 20.4 deep rackmount server ƒ Single AMD EPYC™ 7003/7002 Series Processors ƒ 16 x DIMM sockets DDR4 3200 MHz DDR4 (ECC/RDIMM/LRDIMM) ƒ 4 x FH/FL PCIe x16 Gen4 + 2 low profile x8 slots, or 2 x FH|FL PCIe 4.0 x16 slots + 2 x FH/FL PCIe 4.0 x8 slots + 2 x FH|HL PCIe 4.0 x8 slots + 2

文件:862.07 Kbytes 页数:2 Pages

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1702002600-02

Compact 2U High Capacity Storage Server based on Intel® Xeon® Processor Scalable Family

Features ƒƒ 2U 27.5 deep rackmount server ƒƒ Dual Intel® Xeon® Platinum, Gold, Silver or Bronze Processor (Up to 205W TDP) ƒƒ 16x DIMM sockets support up to 1024GB DDR4 2666 / 2933 MHz DDR4 (ECC/RDIMM/LRDIMM) ƒƒ Rich Add-In Card Support: Up to four FH/FL PCIe x8 Gen3 slots, two FH/HL PCIe x

文件:1.03371 Mbytes 页数:2 Pages

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1702002600-02

Compact 2U Edge Server based on Dual 3rd Gen Intel® Xeon® Scalable Processors

Features ƒ 2U 20.4 deep rackmount server for 5G open RAN and edge computing ƒ Dual 3rd Gen Intel® Xeon® Scalable Processor supporting Platinum, Gold and Silver SKUs ƒ 32 x DIMM sockets DDR4 3200 MHz DDR4 (ECC/RDIMM/LRDIMM) ƒ 4 x FH/FL PCIe x16 Gen4 +2 low profile x8 slots, or 2 x FH|FL PCIe 4

文件:889.4 Kbytes 页数:2 Pages

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1702002600-02

Compact 2U Carrier Grade, High Performance Server based on Intel® Xeon® Processor Scalable Family

Features ƒ 2U 20 deep rackmount server ƒ Dual Intel® Xeon® Platinum, Gold, Silver or Bronze Processor (Up to 165W TDP) ƒ 16x DIMM sockets support up to 1024GB DDR4 2666 / 2933 MHz DDR4 (ECC/RDIMM/LRDIMM) ƒ Rich Add-In Card Support: Up to four FH/FL PCIe x8 Gen3 slots, two FH/HL PCIe x8 Gen3

文件:1.11659 Mbytes 页数:2 Pages

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1702002600-02

1U High Performance Server based on 4th Gen Intel® Xeon® Processor Scalable Family

Features ƒ 1U 31 deep rackmount server ƒ Dual Intel® Xeon® Scalable Gold6, Gold5, Silver or Bronze processor ƒ 32 x DIMM sockets support up 2048GB DDR5 4800/4400 MT/s ƒ PCIe5.0 add-in cards support up to two full-high 3/4 length (FH | 3/4L) PCIe x16 and one OCP3.0 PCIe x16 ƒ Up to twelve NVM

文件:546.68 Kbytes 页数:2 Pages

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1702002600-02

Compact 1U Edge Server based on 3rd Gen Intel Xeon Scalable Processors

Features ƒ 1U 20.4” deep rackmount server for 5G Open RAN and edge computing ƒ Single 3rd Gen Intel® Xeon® Scalable Processor supporting Platinum, Gold and Silver SKUs ƒ 8 x DIMM sockets DDR4 3200 MHz DDR4 (ECC/RDIMM/LRDIMM) ƒ 2 x FH/FL PCIe x16 Gen4 and 2xFH/HL PCIe x16 Gen4 slots ƒ 4 x 2.5

文件:834.27 Kbytes 页数:2 Pages

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1702002600-02

Compact 1U High Performance Server based on 2nd Gen Intel® Xeon® Scalable Processor Family

Features ƒ 1U 29.5 deep rackmount server ƒ Dual Intel® Xeon® Platinum, Gold, Silver or Bronze Processor ƒ 24 x DIMM sockets support up to 1536 GB DDR4 1600/1866/2133/2400/ 2666 MHz SDRAM (ECC/RDIMM/LRDIMM) ƒ Rich Add-In Card Support: Up to four FH/¾L PCIe x16 Gen3 slots ƒ Up to 4 x 2.5 hot-s

文件:828.9 Kbytes 页数:2 Pages

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产品属性

  • 产品编号:

    170200

  • 制造商:

    Brady Corporation

  • 类别:

    标签,标志,护栏,标识 > 标志,铭牌,招贴

  • 系列:

    B-555

  • 包装:

    散装

  • 颜色:

    黑色和红色图例,白底

  • 配套使用/相关产品:

    Notice

  • 材料:

  • 标签类型:

    Notice. For the safety of our customers and employees. If you have or recently had fever, cough, or shortness of breath. Please…

  • 标签尺寸:

    10.00" 长 x 7.00" 宽(254.0mm x 177.8mm)

  • 描述:

    B555,7X10, NOTICE-SYMPTOMS-DO NO

供应商型号品牌批号封装库存备注价格
PHOENIX
25+
连接器
493
就找我吧!--邀您体验愉快问购元件!
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Advantech
22+
NA
6878
加我QQ或微信咨询更多详细信息,
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Phoenix Contact
2022+
原厂原包装
6800
全新原装 支持表配单 中国著名电子元器件独立分销
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Advantech Corp
25+
原厂封装
56000
只做原厂原装正品现货 正品授权货源可追溯
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UNI-ROYAL
2410+
NA
6680
优势代理渠道,原装现货,可全系列订货
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NorcompInc
24+
9310
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NORCOMP
23+
CONN
6
全新、原装
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TEConnectivity
5
全新原装 货期两周
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TE Connectivity
2022+
1
全新原装 货期两周
询价
TE/泰科
2447
SMD
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
询价
更多170200供应商 更新时间2022-12-6 9:27:00