THIS DRAWING IS A CONTROLLED DOCUMENT.

文件：154.44 Kbytes 页数：1 Pages

TEC

泰科电子

INVERT MOUDULAR JACK ASSEMBLY 1 X 1, SHIELDED, PANEL GROUND

INVERT MOUDULAR JACK ASSEMBLY 1 X 1, SHIELDED, PANEL GROUND

文件：195.11 Kbytes 页数：1 Pages

MACOM

INVERT MOUDULAR JACK ASSEMBLY 1 X 1, SHIELDED, PANEL GROUND

INVERT MOUDULAR JACK ASSEMBLY 1 X 1, SHIELDED, PANEL GROUND

文件：195.11 Kbytes 页数：1 Pages

MACOM

INVERT MOUDULAR JACK ASSEMBLY 1 X 1, SHIELDED, PANEL GROUND

INVERT MOUDULAR JACK ASSEMBLY 1 X 1, SHIELDED, PANEL GROUND

文件：195.11 Kbytes 页数：1 Pages

MACOM

INVERT MOUDULAR JACK ASSEMBLY 1 X 1, SHIELDED, PANEL GROUND

INVERT MOUDULAR JACK ASSEMBLY 1 X 1, SHIELDED, PANEL GROUND

文件：195.11 Kbytes 页数：1 Pages

MACOM

INVERT MOUDULAR JACK ASSEMBLY 1 X 1, SHIELDED, PANEL GROUND

INVERT MOUDULAR JACK ASSEMBLY 1 X 1, SHIELDED, PANEL GROUND

文件：195.11 Kbytes 页数：1 Pages

MACOM

INVERT MOUDULAR JACK ASSEMBLY 1 X 1, SHIELDED, PANEL GROUND

INVERT MOUDULAR JACK ASSEMBLY 1 X 1, SHIELDED, PANEL GROUND

文件：195.11 Kbytes 页数：1 Pages

MACOM

INVERT MOUDULAR JACK ASSEMBLY 1 X 1, SHIELDED, PANEL GROUND

INVERT MOUDULAR JACK ASSEMBLY 1 X 1, SHIELDED, PANEL GROUND

文件：195.11 Kbytes 页数：1 Pages

MACOM

Integrated Soldier Power and Data Management System (ISPDS) with USB.3.0 and 1G LAN Capabilities

FEATURES DESCRIPTION The advancement of technologies in the modern warfare has allowed the design of increasingly versatile tools in order to perform effectively and coherently in the battlefield. The modern infantry soldier, fully equipped with advanced weapon and communication systems, has

文件：816.59 Kbytes 页数：3 Pages

ENERCON

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：662.27 Kbytes 页数：32 Pages

MACOM