包装：盒 类别：传感器，变送器 配件 描述：CABLE ASSEMBLY

Sensata-BEI Sensors

FPC CONNECTOR, 0.5mm PITCH, BOTTOM CONTACT, SMT TYPE

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：165.83 Kbytes 页数：3 Pages

MACOM

FPC CONNECTOR, 0.5mm PITCH, BOTTOM CONTACT, SMT TYPE

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：165.83 Kbytes 页数：3 Pages

MACOM

FPC CONNECTOR, 0.5mm PITCH, BOTTOM CONTACT, SMT TYPE

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：165.83 Kbytes 页数：3 Pages

MACOM

FPC CONNECTOR, 0.5mm PITCH, BOTTOM CONTACT, SMT TYPE

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：165.83 Kbytes 页数：3 Pages

MACOM

FPC CONNECTOR, 0.5mm PITCH, BOTTOM CONTACT, SMT TYPE

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：165.83 Kbytes 页数：3 Pages

MACOM

FPC CONNECTOR, 0.5mm PITCH, BOTTOM CONTACT, SMT TYPE

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：165.83 Kbytes 页数：3 Pages

MACOM

FPC CONNECTOR, 0.5mm PITCH, BOTTOM CONTACT, SMT TYPE

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：165.83 Kbytes 页数：3 Pages

MACOM

FPC CONNECTOR, 0.5mm PITCH, BOTTOM CONTACT, SMT TYPE

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：165.83 Kbytes 页数：3 Pages

MACOM

FPC CONNECTOR, 0.5mm PITCH, BOTTOM CONTACT, SMT TYPE

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：165.83 Kbytes 页数：3 Pages

MACOM