丝印：045V；Package：CFP15B；45 V, 5 A low VF Schottky barrier rectifier

1. General description Planar Low VF Schottky barrier rectifier encapsulated in a CFP15B (SOT1289B) power and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Very low forward voltage • High power capability due to clip-bond technology • Small and thin SMD

文件：260.37 Kbytes 页数：11 Pages

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安世安世半导体(中国)有限公司

丝印：045V；Package：CFP15B；45 V, 10 A low VF Schottky barrier rectifier

1. General description Planar Low VF Schottky barrier rectifier encapsulated in a CFP15B (SOT1289B) power and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Very low forward voltage • High power capability due to clip-bond technology • Small and thin SMD

文件：259.44 Kbytes 页数：11 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

丝印：045V；Package：CFP15B；45 V, 10 A low VF Schottky barrier rectifier

1. General description Planar Low VF Schottky barrier rectifier encapsulated in a CFP15B (SOT1289B) power and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Very low forward voltage • High power capability due to clip-bond technology • Small and thin SMD

文件：265.2 Kbytes 页数：11 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

丝印：045V；Package：CFP15B；45 V, 15 A low VF Schottky barrier rectifier

1. General description Planar Low VF Schottky barrier rectifier encapsulated in a CFP15B (SOT1289B) power and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Very low forward voltage • High power capability due to clip-bond technology • Small and thin SMD

文件：264.41 Kbytes 页数：11 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

丝印：045V050E；Package：CFP15B；45 V, 5 A low VF Schottky barrier rectifier

1. General description Planar Low VF Schottky barrier rectifier encapsulated in a CFP15B (SOT1289B) power and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Very low forward voltage • High power capability due to clip-bond technology • Small and thin SMD

文件：260.79 Kbytes 页数：11 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

丝印：045VM10E；Package：CFP15B；45 V, 10 A low VF Schottky barrier rectifier

1. General description Planar Low VF Schottky barrier rectifier encapsulated in a CFP15B (SOT1289B) power and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Very low forward voltage • High power capability due to clip-bond technology • Small and thin SMD

文件：260.019 Kbytes 页数：11 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

丝印：045V100E；Package：CFP15B；45 V, 10 A low VF Schottky barrier rectifier

1. General description Planar Low VF Schottky barrier rectifier encapsulated in a CFP15B (SOT1289B) power and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Very low forward voltage • High power capability due to clip-bond technology • Small and thin SMD

文件：265.61 Kbytes 页数：11 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

丝印：045V150E；Package：CFP15B；45 V, 15 A low VF Schottky barrier rectifier

1. General description Planar Low VF Schottky barrier rectifier encapsulated in a CFP15B (SOT1289B) power and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Very low forward voltage • High power capability due to clip-bond technology • Small and thin SMD

文件：264.82 Kbytes 页数：11 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

丝印：045V050E；Package：CFP15；45 V, 5 A low VF MEGA Schottky barrier rectifier

文件：712.33 Kbytes 页数：15 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

丝印：045V100E；Package：CFP15；45 V, 10 A low VF MEGA Schottky barrier rectifier

文件：718.15 Kbytes 页数：15 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司